The effects of different fabric materials namely weave designs (plain and satin) and fabric
counts (5× 5 and 6× 6) on the properties of laminated woven kenaf/carbon fibre reinforced …

Optoelectronic devices that are stretchable can revolutionize various fields by enabling the
functionalities that are not accessible from conventional rigid platforms. In this respect, many …

Shape-morphing structures based on pressure actuation promise efficiency gains and
performance improvements in aeronautics, but require complex three-dimensional …

Neutral plane strategies have been studied to reduce the tensile strain of brittle films in
foldable electronics under bending. However, those strategies depend on the dimensions of …

Semiconductor packaging continues to reduce in thickness following the overall thinning of
electronic devices such as smartphones and tablets. As the package becomes thinner, the …

Flexible micro-light-emitting diodes (f-μLEDs) have been regarded as an attractive light
source for the next-generation human–machine interfaces, thanks to their noticeable …

Semiconductor packaging based on an epoxy molding compound (EMC) currently has
several disadvantages including warpage, limited processing area, and variability that all …

Single-ply weave-reinforced shape memory polymer composites (SpWR_SMPCs) are
promising materials for deployable space structures because they have high deformability …

For flexible devices that inevitably undergo repetitive deformations, it is important to evaluate
and control the mechanical strain imposed on the flexible systems for enhancing the …

Conventional testing methods face limitations in identifying the mechanical properties of
flexible film coatings. In this study, the mechanical properties of the polydimethylsiloxane …