Silicon is the most widely used material in numerous fields. Traditional mechanical
machining methods have been unable to meet the higher requirements of processing …

Die singulation, also known as wafer dicing, is reviewed in terms of the brief history, critical
challenges, characterization of singulation quality, different singulation technologies and …

Abstract Silicon Carbide (SiC) is an important substrate material for electronic components
due to its excellent properties. Compared with wire sawing technology, laser slicing …

A systematic study of glass scribing is presented on the benefits of ultrafast laser burst trains
in generating filamentation tracks to guide cleaving of glass substrates. The interplay of Kerr …

Stealth dicing is widely utilized in wafer manufacturing due to its excellent advantages, such
as debris-free and narrow kerf width, over the conventional process dicing method …

Silicon carbide (SiC), due to its characteristic materials performance, gets more attention in
Radio Frequecy (RC) and High-power device fabrication. However, SiC wafer dicing has …

Separation of silicon wafers is an integral part of semiconductor device manufacture. The
widely used mechanical separation methods produce large kerf widths and micro-cracks …

We report on defects characterization and reduction as well as die strength enhancement
using stealth dicing (SD) on high-backside reflectance (82%) 2-D NAND memory wafers …

摘要硅是半导体领域使用最广泛的材料, 近几年随着制程工艺的发展, 传统的机械划片方法已经
无法满足更高的加工质量要求. 现有激光开槽与金刚石刀结合的划片工艺, 多采用纳秒多光束的 …

Stealth dicing (SD) is an innovative dicing method developed by Hamamatsu Photonics KK
In the SD method, a permeable nanosecond laser is focused inside a silicon wafer and …