This encyclopedia, written by authoritative experts under the guidance of an international
panel of key researchers from academia, national laboratories, and industry, is a …

Abstract Sn-34 wt% Bi, Sn-34 wt% Bi-2wt% Ag and Sn-34 wt% Bi-0.7 wt% Cu alloys have
been directionally solidified (DS) under a broad range of solidification cooling rates …

The effect of the high magnetic field (MF) on the distribution of solute concentration during
directional solidification of Al-Cu alloy under low growth speed was experimentally …

Alloys from the Snsingle bondCu systems have superior properties as compared to the
Snsingle bondPb alloys, such as mechanical and corrosion resistance. However, Snsingle …

Sn–Ag‐based alloys are considered good alternatives to soldering operations as compared
with the traditional Sn–Pb solder alloys. Herein, the effects of 0.5 and 1.0 wt% Zn additions …

The effect of In on melting property, microstructure and mechanical properties of Sn–40Bi–x
In (x= 0, 1, 2, 4, 6, 8 wt%, respectively) alloys was investigated by means of differential …

The interfacial reactions of Zn30Sn (ZS), Zn30Sn-1Ge (ZS-1Ge), and Zn30Sn–1In (ZS-1In)
on the Cu substrate were investigated. After reflowing at 450° C for 5 min, the ε-CuZn 5 …

Mg and Mg-based alloys are lightweight metallic materials that are extremely biocompatible
and have promising mechanical properties. Mg–Zn alloys have potential applications as …

Sn-Sb alloys are among the current alternatives for the development of alloys for high-
temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to …

A novel-type Zn–30Sn–2Cu–0.5 Ni–0.2 Al multicomponent high-temperature lead-free
solder alloy was prepared, and its thermal behavior, electrochemical properties were …