Oriented design of wafer-level stacking structures to enhance reliability of laser debonding of thin devices
F Wang, Q Liu, J Li, M Huang, W Dai, X Wang… - Optics & Laser …, 2024 - Elsevier
The laser debonding process in advanced packaging has become a key technology for the
debonding of ultra-thin wafers. However, improving the reliability of debonding and efficient …
debonding of ultra-thin wafers. However, improving the reliability of debonding and efficient …