Modern computer microprocessor chips are marvels of engineering complexity. For the
current 45 nm technology node, there may be nearly a billion transistors on a chip barely 1 …

Future integrated circuits and packages will require extraordinary dielectric materials for
interconnects to allow transistor advances to be translated into system-level advances …

An issue in microfabrication of the fluidic channels in glass/poly (dimethyl siloxane)(PDMS)
is the absence of a well-defined study of the bonding strength between the surfaces making …

This paper presents an in-depth overview of the present status and novel developments in
the field of plasma processing of low dielectric constant (low-k) materials developed for …

Electrochemical reduction of lithium ion battery electrolyte on Si anodes was mitigated by
synthesizing nanoscale, conformal polymer films as artificial solid electrolyte interface (SEI) …

Metal–organic frameworks (MOFs) belong to a class of hybrid materials that are
unparalleled in their degree of structural diversity and functional tunability. The construction …

Cyclic tetrasiloxane polymer (CTP) has recently garnered interest as a hydrophobic material
with unique properties. This study aims to enhance the dielectric constant of CTP films by …

This study explores the energetics and structure of polymer derived ceramics (PDCs)
derived from the pyrolysis of preceramic polymers: SPR-212 (SPR) …

Five novel azo dyes molecules with different intramolecular charge transfer (ICT) characters
were synthesized and characterized. Their thermal stabilities were studied with …

Mixed matrix composite membranes (MMCMs) have shown advantages in reducing VOCs
and CO2 emissions. Suitable composite layer, substrate, and good compatibility between …