In this letter, a quasi-coaxial through-silicon-via (TSV) is presented for millimeter-wave
integrated circuit (IC) packaging. The quasi-coaxial-via (Q-COV) structure in which one side …

This paper presents a novel approach to construct a multiple-input multiple-output (MIMO)
antenna in a small package based on integrated passive device (IPD) manufacturing …

We propose a miniaturized wideband metasurface antenna for 60-GHz antenna-in-package
applications. With the glass integrated passive device manufacturing technology, we …

An antenna miniaturization technique that can substantially miniaturize an antenna to allow
its incorporation into a compact package for WLAN (2.4-2.484 GHz) applications is …

In this paper, we present a high efficiency antenna for 60 GHz low-cost packaged modules.
This antenna is fabricated using IPD™ technology which is flip-chipped on a PCB …

In this paper, we present several antennas for 60 GHz low-cost packaged modules. These
antennas are fabricated using a PCB substrate and the IPD™ technology. In the first part, an …

This thesis describes methods and techniques for realizing a fully integrated radar sensor in
the frequency range above 100 GHz. The wavelength in the milimeter range leads to an …

As a result of their myriad of advantages over silicon and other conventional substrate
technologies, glass substrates have received significant attention from the electronic …

提出一种面向封装天线应用的60-GHz 小型化宽带超表面天线. 基于玻璃集成无源器件制造技术,
采用共面波导馈电环形谐振器表征玻璃基板的材料特性. 该天线于高介电常数玻璃基板上设计以 …

IPD™ technology offers an aggressive process in terms of drawing lines, on a low loss glass
substrate. This process is widely used for low frequency circuits (1-10 GHz). In this paper, we …