The restriction of using toxic and harmful Sn-Pb solders has led to the rapid development of
lead-free solders in recent decades. This research on the effect of indium (In) microalloying …

The study investigated the growth kinetics and rate-controlling processes of intermetallic
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …

Sn-Zn system solder has been considered promising lead-free solder materials to replace
Sn-Pb and Sn-Ag-Cu systems in various conditions, due to the performance characteristics …

This study investigates the microstructural evolution and growth behavior of intermetallic
compound (IMC) layers in the Cu/(Sn-yAg, y= 0.29∼ 2.00 wt.%) system during isothermal …

In this study, different weight fractions (0, 0.2, 0.5, 0.7, and 1.0 wt%) of cerium oxide (CeO 2)
nanoparticles were used to enhance the properties of Sn–58Bi–1Ag (SBA) solder alloys. As …

The void defect in intermetallic compounds (IMCs) layer at the joints caused by
inhomogeneous atomic diffusion is one of the most important factors limiting the further …

We present our findings of a large-scale screening for new synthesizable materials in five M–
Sn binaries, M= Na, Ca, Cu, Pd, and Ag. The focus on these systems was motivated by the …

This study addresses the critical need for lead-free solder alternatives in electronic
manufacturing by investigating the microstructural characteristics of Sn-Ag solder alloys …

Abstract The effects of Sb/In (with a loading x of 1, 2, 3 wt.%) in the Sn5Bi solder alloy on the
melting properties, microstructures, and the shear behavior of solder/Cu joints were …

This study investigated the impact of different bismuth (Bi) contents on the mechanical
properties, melting point, and corrosion resistance of tin–copper (Sn–Cu) series alloys (Sn …