Abstract The Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.6 B 4 C/Cu joints were prepared by transient
liquid phase (TLP) bonding technology to verify the reliability of low-temperature connection …

Abstract Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05 AlN/Cu were prepared by transient liquid-
phase bonding (TLP) bonding process for low temperature bonding and high temperature …

With the rapid iteration of microsystem integrated technology, the miniaturization of
electronic devices requires packaging materials with higher reliability. In this work, the …

The thickness of Cusingle bondSn intermetallic compounds (IMCs) plays a crucial role in
determining the quality of laser soldering joints. However, there is a lack of research on laser …

The microstructure and intermetallic compound (IMC) growth in Sn58Bi/Cu and Sn58Bi-0.4
Mg/Cu solder joints were examined in this study under varied thermal aging time (6, 12, 18 …

Sn–Bi based solders are used in electronic packaging for interconnection processes.
However, the rate of research on the comprehensive performance of solders is difficult to …

In the era of big data, the advantages of 3D packaging are becoming increasingly
significant. In addition, the mismatch between the coefficient of thermal expansion (CTE) of …

Multiple reflow processes are utilized in complex electronic devices with multi-layered PCBs,
stacked components, or 3D configurations to ensure reliable connections and minimize …

High-power insulated gate bipolar transistor (IGBT) modules are the key devices for energy
change and transmission. Reflow soldering process is a crucial process in IGBT module …

A comprehensive study of the formation of electrical insulation coatings on SiC p/Al
composite using plasma electrolytic oxidation (PEO) in an electrolytic system with hBN …