Interaction integral method for thermal fracture of nonhomogeneous magneto-electro-elastic materials
S Zhu, H Yu, L Hao, Z Shen, J Wang, L Guo - European Journal of …, 2023 - Elsevier
This paper focuses on the thermal fracture performance of magneto-electro-elastic (MEE)
materials and proposes a new interaction integral (I-integral) method for extracting the key …
materials and proposes a new interaction integral (I-integral) method for extracting the key …
Analysis of an interfacial crack between two nonhomogeneous piezoelectric materials using a new domain-independent interaction integral
S Zhu, H Yu, L Guo - Composite Structures, 2024 - Elsevier
Considering the difficulties introduced by piezoelectric material non-homogeneity and
discontinuities to interfacial crack analysis, a domain-independent interaction integral (DII …
discontinuities to interfacial crack analysis, a domain-independent interaction integral (DII …
A new creep-fatigue interaction damage model and CDM-XFEM framework for creep-fatigue crack growth simulations
In this paper, a coupled continuum damage mechanics (CDM) and extended finite element
method (XFEM) based methodology is developed to predict the crack growth life under …
method (XFEM) based methodology is developed to predict the crack growth life under …
A numerical study of semipermeable cracks in Magneto-Electro-Elastic material using XFEM
In this paper, an XFEM-based framework is presented to model the semipermeable crack in
magneto-electro-elastic (MEE) material. The interaction-integral technique is modified and …
magneto-electro-elastic (MEE) material. The interaction-integral technique is modified and …
A microstructure based elasto-plastic polygonal FEM and CDM approach to evaluate LCF life in titanium alloys
This work presents the influence of microstructure on the LCF life of two-phase titanium
alloys. An elasto-plastic polygonal FEM and continuum damage mechanics approach has …
alloys. An elasto-plastic polygonal FEM and continuum damage mechanics approach has …
A new framework based on XFEM to study the role of electrostatic tractions in semipermeable piezoelectric material
In this work, a crack opening model is proposed to study the role of electrostatic tractions in a
cracked semipermeable piezoelectric material. The extended finite element method (XFEM) …
cracked semipermeable piezoelectric material. The extended finite element method (XFEM) …
Influences of magneto-electro-elastic layer properties of piezoelectric/piezomagnetic composites on dynamic intensity factors
S Zhu, H Yu, L Hao, C Huang, Z Shen, J Wang… - Applied Mathematical …, 2023 - Elsevier
Abstract Magneto-electro-elastic (MEE) materials are composed of piezoelectric (PE) and
piezomagnetic (PM) phases, leading to the existence of a large number of interfaces …
piezomagnetic (PM) phases, leading to the existence of a large number of interfaces …
Generalized dynamic domain-independent interaction integral in the transient fracture investigation of magneto-electro-elastic composites
S Zhu, H Yu, Y Zhang, H Yan, S Man, L Guo - Engineering Fracture …, 2023 - Elsevier
The domain-independent interaction integral (DII-integral) is a powerful tool for dealing with
crack issues of nonhomogeneous materials, due to its feature of being independent of the …
crack issues of nonhomogeneous materials, due to its feature of being independent of the …
Effect of stress ratio and welding residual stresses on the fatigue crack growth behaviour of Weldox-700 steel using LGDM
In this work, numerical simulations of high-cycle fatigue and fatigue crack growth have been
performed using localizing gradient damage methodology (LGDM) for base and welded …
performed using localizing gradient damage methodology (LGDM) for base and welded …
Nonlinear thermo-elastic analysis of edge dislocations with Internal Heat Generation in Semiconductor Materials
In this work, the nonlinear thermo-elastic analysis of edge dislocations with internal heat
generation is performed by the extended finite element method (XFEM) in semiconductor …
generation is performed by the extended finite element method (XFEM) in semiconductor …