Polyimides (PIs) are an important, well-established, and commercialized class of polymers
due to their extraordinary physical and chemical properties. They have been extensively …

The development of polyimides (PIs) with a superheat resistance and a high thermal
dimensional stability is required urgently for application in the rapidly growing area of …

Low coefficient of thermal expansion (CTE) in the range of 40–400° C is a crucial factor for
polyimide (PI) films serving as the flexible substrate for display devices. The introduction of …

Carbon molecular sieve (CMS)‐based membrane separation is a promising solution for
hydrogen separation due to its great advantages on perm‐selectivity, thermal stability, and …

A series of novel aromatic polyimide (PI) films containing xanthone moiety was prepared
through a two-step procedure, namely, the polymerization of 2, 7-diaminoxanthone (2, 7 …

To achieve the superheat-resistant polymers for flexible display substrates, two new
diamines, namely 6-amine-2-(4-aminobenzene)-1-methyl-benzimidazole (m-MePABZ), 5 …

Polyimide (PI) films with ultralow coefficient of thermal expansion (CTE) and high glass
transition temperature (Tg) are in great demand for applications as substrates in flexible …

Multiple hydrogen bonds (multi-HBs) can not only realize supramolecular polymerization but
also significantly improve the mechanical properties of materials. Although it is known that …

A pair of isomer diamines containing both benzimidazole and benzoxazole and derived
homopolyimides were synthesized for the first time. Due to rich rigid and linear benzoazole …

To tolerate high processing temperature during the fabrication of low‐temperature
polycrystalline silicon thin‐film transistors (LTPS–TFT) in flexible OLED devices, the …