Microprocessor design has recently encountered many constraints such as power, energy,
reliability, and temperature. Among these challenging issues, temperature-related issues …

Thermal modeling and simulation have become imperative in recent years owing to the
increased power density of high performance microprocessors. Temperature is a first-order …

In current day microprocessors, exponentially increasing power densities, leakage, cooling
costs, and reliability concerns have resulted in temperature becoming a first class design …

3D circuits have the potential to improve performance over traditional 2D circuits by reducing
wirelength and interconnect delay. One major problem with 3D circuits is that their higher …

This paper presents the first multiobjective microarchitectural floorplanning algorithm for
high-performance processors implemented in two-dimensional (2-D) and three-dimensional …

Temperature affects not only the performance but also the power, reliability, and cost of the
embedded system. This paper proposes a temperature-aware task allocation and …

Power density of microprocessors is increasing with every new process generation resulting
in increasingly higher maximum chip temperatures. The high temperature of the chip greatly …

Temperature affects not only the reliability but also the performance, power, and cost of the
embedded system. This paper proposes a thermal-aware task allocation and scheduling …

Floorplanning is an important physical design step in the ASIC design flow. It is the process
of estimating the area to be occupied by various blocks in a layout together with a precise …

Floorplanning is an ever-emerging field in the Very Large Scale Integration (VLSI) circuit
design automation since it deals with essential design metrics of a floorplan, such as chip …