Pb-based solders have been the cornerstone technology of electronic interconnections for
many decades. However, with legislation in the European Union and elsewhere having …

During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder
has attracted wide attention due to its excellent comprehensive performance and low cost. In …

Today, a growing number of third-generation semiconductor-based power devices are used
in products that can continuously operate at high temperatures for extended periods of time …

The influences of In element on microstructure and properties of Sn–Bi based lead-free
solder were investigated in this study. With In element addition, the amount of primary Sn …

This paper aims to focus on the current developments of Microwave Hybrid Heating (MHH)
as a promising alternative method in soldering, characterization of solder joint properties …

Abstract Sn-0.7 Cu is among the least expensive types of lead-free solders available.
However, its poor mechanical properties have limited its application. In this study, Sn-Cu …

The use of reinforcing high performance ceramic particulates in monolithic lead-free solder
is one way to improve the service temperature and mechanical behavior of a solder joint. In …

Purpose–The aim of the present study was to gather and review all the important properties
of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the …

Abstract Fifty-pair Bi 2 Te 3-based thermoelectric (TE) modules were produced by spreading
Sn alloy solder on Cu electrodes before heating at 270° C for 10 min to connect Bi 2 Te 3 …