The progressively decreasing feature size of the circuit components has tremendously
increased the need for the global surface planarization of the various thin film layers that …

Chemical mechanical planarization (CMP) has become one of the most critical processes in
semiconductor device fabrication to achieve global planarization. To achieve an efficient …

A micro-contact and wear model for chemical–mechanical polishing (CMP) of silicon wafers
is presented in this paper. The model is developed on the basis of elastic–plastic micro …

ReaxFF reactive molecular dynamics simulations are employed to study the process of the
silica abrasive particle sliding on the Si (1 0 0) substrate in the aqueous H 2 O 2 in order to …

With magnetic heads operating closer to hard disks, the hard disks are forced to be ultra-
smooth. At present, chemical–mechanical polishing (CMP) has become a widely accepted …

Scanning probe microscopy (SPM) techniques, specifically so-called atomic force/friction
force microscopy (AFM/FFM) are increasingly used for tribological studies of engineering …

Chemical mechanical planarisation (CMP) is a polishing process used in the fabrication of
silicon wafers to achieve a globally planar wafer surface. The removal of material from the …

This paper presents a mathematical model that describes the chemical–mechanical synergy
and mechanism of material removal in chemical–mechanical polishing (CMP). The physical …

The chemo-mechanical polishing process (CMP) has received much attention recently
because of its importance as a nano-scale finishing process for high value-added large …

This paper describes a multiscale model for material removal during conventional chemical
mechanical polishing (CMP). Three spatial scales are considered in the integrated model:(i) …