A review of metallic materials for latent heat thermal energy storage: Thermophysical properties, applications, and challenges

SC Costa, M Kenisarin - Renewable and Sustainable Energy Reviews, 2022 - Elsevier
Phase change materials provide desirable characteristics for latent heat thermal energy
storage by keeping the high energy density and quasi isothermal working temperature …

Copper–graphite–copper sandwich: superior heat spreader with excellent heat-dissipation ability and good weldability

B Jiang, H Wang, G Wen, E Wang, X Fang, G Liu… - RSC …, 2016 - pubs.rsc.org
The thermal management of smart and wearable electronics has become a serious issue,
due to their reducing size and increasing power density, which has high requirement on …

Microstructure, melting behavior and thermal conductivity of the Sn–Zn alloys

D Manasijević, L Balanović, I Marković, M Gorgievski… - Thermochimica …, 2021 - Elsevier
Abstract Four hypereutectic Sn-Zn alloys with 69.5, 48.3, 28.1 and 14.1 at% of Zn were
produced by mixing and melting of pure metals Sn and Zn followed by cooling in air to room …

An alternative thermal approach to evaluate the wettability of solder alloys

WLR Santos, BL Silva, F Bertelli, JE Spinelli… - Applied thermal …, 2016 - Elsevier
The aim of the work is to propose an alternative method to qualitatively evaluate the
wettability of different alloys of a particular alloy system. The technique is based on a thermal …

The effect of the solidification rate on the physical properties of the Sn-Zn eutectic alloy

M Şahin, F Karakurt - Physica B: Condensed Matter, 2018 - Elsevier
Abstract As-cast Sn-8.8 wt.% Zn eutectic alloy was directionally solidified with a constant
temperature gradient (G= 4.16 K/mm) under various solidification rates (V= 8.3–790 μm/s) in …

Structural and thermo-electrical properties of Sn–Al alloys

F Meydaneri Tezel, B Saatçi, M Arı, S Durmuş Acer… - Applied Physics A, 2016 - Springer
Thermal conductivities of pure Sn, pure Al and Sn-x wt% Al [x= 0.5, 2.2, 25, 50, 75] binary
alloys were measured by radial heat flow method and were found to be 60.60, 208.80 …

Room temperature bonding on interface between metal and ceramic

KB Jang, S Mhin, SC Lim, YS Song, KH Lee… - Journal of Electronic …, 2019 - Springer
The influence of surface activated bonding (SAB) on adhesion strength between a metal and
ceramic including Al/AlN and Cu/AlN is investigated. Plasma pre-treatments can significantly …

The effect of substrate microstructure on the heat-affected zone size in sn-zn alloys due to adjoining Ni-Al reactive multilayer foil reaction

RJ Hooper, DP Adams, D Hirschfeld… - Journal of Electronic …, 2016 - Springer
The rapid release of energy from reactive multilayer foils can create extreme local
temperature gradients near substrate materials. In order to fully exploit the potential of these …

Thermophysical structure-sensitive properties of Tin–Zinc alloys

Y Plevachuk, V Sklyarchuk, P Svec, P Svec… - Journal of Materials …, 2017 - Springer
Tin–zinc-based alloys are under intense consideration as alternative lead-free solders for
consumer electronics and telecommunications. This is because of their excellent creep …

[PDF][PDF] 19 th INTERNATIONAL FOUNDRYMEN CONFERENCE

D Manasijević, L Balanović, I Marković… - PROCEEDINGS … - repozitorij.unizg.hr
Abstract Four hypereutectic Sn-Zn alloys with 69.5, 48.3, 28.1 and 14.1 at.% of Zn were
produced by mixing and melting of pure metals Sn and Zn followed by cooling in air to room …