Mathematical framework of tetramorphic MWCNT configuration for VLSI interconnect

AB Amin, MS Ullah - IEEE Transactions on Nanotechnology, 2020 - ieeexplore.ieee.org
Having a 1D material like Multiwall Carbon Nanotube (MWCNT) as a potential candidate for
high speed Very Large Scale Integration (VLSI) interconnect creates a good scope to reduce …

Influence of temperature on MWCNT bundle, SWCNT bundle and copper interconnects for nanoscaled technology nodes

K Singh, B Raj - Journal of Materials Science: Materials in Electronics, 2015 - Springer
This paper presents the comparative analysis of temperature dependent performance of
Multi-walled carbon nanotubes (MWCNT), Single-walled carbon nanotube (SWCNT) and …

Performance and analysis of temperature dependent multi-walled carbon nanotubes as global interconnects at different technology nodes

K Singh, B Raj - Journal of Computational Electronics, 2015 - Springer
A temperature dependent performance in terms of power delay product (PDP) of multi-
walled carbon nanotube (MWCNT) bundle interconnect has been analyzed for temperature …

Performance modeling and analysis of carbon nanotube bundles for future VLSI circuit applications

M Sahoo, P Ghosal, H Rahaman - Journal of Computational Electronics, 2014 - Springer
In this work, we have presented a comprehensive analysis of the performance of copper
(Cu) and existing carbon nano tube (CNT) bundle structures (ie SWCNT, DWCNT and …

A comparative analysis of copper and carbon nanotubes-based global interconnects in 32 nm technology

A Joshi, G Soni - Proceedings of Fifth International Conference on Soft …, 2016 - Springer
At a high-pace advancements in the technologies today and their ubiquitous use, speed and
size, has been the important aspects in VLSI interconnect. Channel length of device …

Impact of tunneling conductance on the performance of multi walled carbon nanotubes as VLSI interconnects for nano-scaled technology nodes

P Litoria, KS Sandha, A Kansal - Journal of Materials Science: Materials in …, 2017 - Springer
Multi walled carbon nanotube (MWCNT) has received most of the attention for their unique
characteristics as a possible alternative for copper as a VLSI interconnects for future …

Impact of Technology Scaling in DSM Region on Performance of Intercalation-doped MLGNR as VLSI Interconnects

T Kaur, MK Rai, R Khanna - 2023 2nd Edition of IEEE Delhi …, 2023 - ieeexplore.ieee.org
Intercalation-doped multilayer graphene nano-ribbons (ID-MLGNR) have been proposed as
a potential contender for interconnect applications. In the present research work, the impact …

Interconnect modeling, cnt and gnr structures, properties, and characteristics

BK Kaushik, VR Kumar, A Patnaik, BK Kaushik… - Crosstalk in Modern On …, 2016 - Springer
This chapter reviews the Cu-based on-chip interconnect modeling. The unique atomic
structure and properties of carbon nanotube (CNT) and graphene nanoribbon (GNR) are …

Thermally aware modeling and performance for MWCNT bundle as VLSI interconnects for high performance integrated circuits

KS Sandha, B Raj - 2015 IEEE 4th Global Conference on …, 2015 - ieeexplore.ieee.org
In the recent times MWCNT bundle interconnects at global interconnect level, has been
considered as an alternative to the conventional copper interconnects. In this paper, the …

[引用][C] Effect of Tunneling Conductance on the Performance of Multi Walled Carbon Nanotubes as VLSI Interconnects

P Litoria, KSG Sandha - 2016