Microelectromechanical systems (MEMS) have recently become an important area of
technology, building on the success of the microelectronics industry over the past 50 years …

We have developed a novel chip-level membrane deflection experiment particularly suited
for the investigation of sub-micron thin films and microelectro-mechanical systems. The …

An apparatus has been designed and implemented to measure the elastic tensile properties
(Young's modulus and tensile strength) of surface micromachined polysilicon specimens …

The rapid growth of microelectromechanical systems (MEMS) industry has introduced a
need for the characterization of thin film properties at all temperatures encountered during …

Measurement of the mechanical properties of thin-film materials such as polysilicon is
difficult because of the small sizes, forces, and displacements involved as well as the need …

The microscopic mechanical devices in microelectromechanical systems (MEMS) use
materials such as silicon and many other thin films, which had not previously been …

To evaluate the long-term durability properties of materials for microelectromechanical
systems (MEMS), the stress-life (S/N) cyclic fatigue behavior of a 2-μm thick polycrystalline …

The size effect on structural strength is an important phenomenon with a very old history.
Unfortunately, despite abundant experimental evidence, this phenomenon is still not taken …

The mechanical properties of thin-film, low-pressure chemical vapor deposited silicon nitride
were measured in uniaxial tension and by a bulge test method suitable for wafer-level …

Tensile specimens of polysilicon are deposited on a silicon wafer; one end remains affixed
to the wafer and the other end has a relatively large paddle that can be gripped by an …