Data centers are increasingly important for global societal and economic advancement. The
reliable operation of data centers depends on robust thermal management systems for …

This paper introduces a novel approach to address thermal management challenges in
system-in-package (SiP) technology, which is a significant concern in various advanced …

Accurate thermal analysis is essential for the design of reliable of system-in-package (SiP).
This paper proposes a transient thermal analysis of the SiP technology based on four chips …

Since accurate thermal analysis is essential for the design and thermal management of
System-in-Package (SiP). This paper proposes a transient thermal analysis of the System-in …

We present in this paper a new modified version of the System-in-Package (SiP) model
based on three-layer chips. The idea is to add copper layers permitting to take up its thermal …

The reliability and lifetime of systems-on-chip (SoCs) are being seriously threatened by
thermal issues. In modern SoCs, dynamic thermal management (DTM) uses the thermal …

The LabPET II detection module serves as the fundamental component within Positron
Emission Tomography (PET) scanners designed for achieving ultra-high-resolution imaging …

The thermal management of three-dimensional System-in-Package (3D-SiP) has garnered
significant attention from researchers. Through Silicon Vias (TSVs) have been extensively …

Fine-grained methods for on-chip sensing of physical parameters in Field Programmable
Gate Array (FPGA) designs are nowadays really desired. Thermal monitoring techniques are …

In multicore System-on-Chips (SoCs), Network on Chip (NoC) is utilized to facilitate on chip
communication due to its benefits over bus-based topologies, specifically as chip sizes go …