Overview on fabrication of three-dimensional structures in multi-layer ceramic substrate

LE Khoong, YM Tan, YC Lam - Journal of the European Ceramic Society, 2010 - Elsevier
Three-dimensional structures in a multi-layer ceramic substrate are important in realizing
ceramic-based meso-and micro-systems. During lamination and/or co-firing, three …

3D printed mould-based graphite/PDMS sensor for low-force applications

A Nag, S Feng, SC Mukhopadhyay, J Kosel… - Sensors and Actuators A …, 2018 - Elsevier
This paper concerns the design, fabrication and characterization of graphite/PDMS sensors
for low-force sensing applications. Exploiting the design flexibility of 3D printing, moulds of …

Wireless LTCC-based capacitive pressure sensor for harsh environment

J Xiong, Y Li, Y Hong, B Zhang, T Cui, Q Tan… - Sensors and Actuators A …, 2013 - Elsevier
This paper presents a wireless capacitive pressure sensor based on LTCC (low temperature
co-fired ceramic) technology, where the design, fabrication, and measurement of the sensor …

3D melt-extrusion printing of medium chain length polyhydroxyalkanoates and their application as antibiotic-free antibacterial scaffolds for bone regeneration

E Marcello, R Nigmatullin, P Basnett… - ACS Biomaterials …, 2024 - ACS Publications
In this work, we investigated, for the first time, the possibility of developing scaffolds for bone
tissue engineering through three-dimensional (3D) melt-extrusion printing of medium chain …

A harsh environment-oriented wireless passive temperature sensor realized by LTCC technology

Q Tan, T Luo, J Xiong, H Kang, X Ji, Y Zhang, M Yang… - Sensors, 2014 - mdpi.com
To meet measurement needs in harsh environments, such as high temperature and rotating
applications, a wireless passive Low Temperature Co-fired Ceramics (LTCC) temperature …

Chip-last (RDL-first) fan-out panel-level packaging (FOPLP) for heterogeneous integration

JH Lau, CT Ko, CY Peng, KM Yang… - Journal of …, 2020 - meridian.allenpress.com
In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

Microchannel fabrication process in LTCC ceramics

K Malecha, LJ Golonka - Microelectronics Reliability, 2008 - Elsevier
This paper describes a simple method of fluidic microchannel fabrication in low temperature
co-fired ceramic (LTCC) substrates. This method is based on a new two-step lamination …

Fabrication of embedded microfluidic channels in low temperature co-fired ceramic technology using laser machining and progressive lamination

MF Shafique, A Laister, M Clark, RE Miles… - Journal of the European …, 2011 - Elsevier
This paper describes the application of laser micromachining techniques for the fabrication
of microfluidic channels in low temperature co-fired ceramic, LTCC, technology. It is shown …

Processing procedures for the realization of fine structured channel arrays and bridging elements by LTCC-Technology

W Smetana, B Balluch, G Stangl, S Lüftl… - Microelectronics …, 2009 - Elsevier
This report deals with technological procedures to provide channel partition walls of
minimum width inside of Low Temperature Co-fired Ceramics (LTCC) micro fluidic devices …

Measurement of wireless pressure sensors fabricated in high temperature co-fired ceramic MEMS technology

J Xiong, S Zheng, Y Hong, J Li, Y Wang… - Journal of Zhejiang …, 2013 - Springer
High temperature co-fired ceramics (HTCCs) have wide applications with stable mechanical
properties, but they have not yet been used to fabricate sensors. By introducing the wireless …