Influence of carbon on pBTI degradation in GaN-on-Si E-mode MOSc-HEMT

AG Viey, W Vandendaele, MA Jaud… - … on Electron Devices, 2021 - ieeexplore.ieee.org
In this article, threshold-voltage V TH instabilities under positive gate voltage stress V
GStress in GaN-on-Si devices are thoroughly investigated. Measurement-stress …

Study on the difference between ID (VG) and C (VG) pBTI shifts in GaN-on-Si E-mode MOSc-HEMT

AG Viey, W Vandendaele, MA Jaud… - 2021 IEEE …, 2021 - ieeexplore.ieee.org
In this study, we investigate the difference between ID (VG) and C (VG) pBTI shifts on GaN-
on-Si E-mode MOS-channel HEMTs, under various gate voltage stresses (V GStress) and …

A novel insight of pBTI degradation in GaN-on-Si E-mode MOSc-HEMT

W Vandendaele, X Garros, T Lorin… - 2018 IEEE …, 2018 - ieeexplore.ieee.org
For the first time, ultrafast AC pBTI measurements are applied to GaN on Si E-mode MOSc-
HEMT and compared to DC pBTI. Full recess Al 2 O 3/GaN MOS gate is submitted to AC …

Characterization and modeling of NBTI in nanoscale ultrathin body ultrathin box FD-SOI MOSFETs

TA Karatsori, CG Theodorou… - … on Electron Devices, 2016 - ieeexplore.ieee.org
The negative bias temperature instability (NBTI) is investigated in ultrathin body ultrathin box
(UTBB) fully depleted silicon-on-insulator (FD-SOI) p-MOSFETs with zero back gate bias …

[图书][B] Modeling and simulation tools for aging effects in scaled CMOS design

K Sutaria - 2014 - search.proquest.com
The aging process due to Bias Temperature Instability (both NBTI and PBTI) and Channel
Hot Carrier (CHC) is a key limiting factor of circuit lifetime in CMOS design. Threshold …

Duty cycle shift under static/dynamic aging in 28nm HK-MG technology

KB Sutaria, P Ren, A Mohanty, X Feng… - 2015 IEEE …, 2015 - ieeexplore.ieee.org
Aging due to bias-temperature-instability (BTI) is the dominant cause of functional failure in
large scale logic circuits. Power efficient techniques such as clock gating or dynamic voltage …

Relaxation-free characterization of Flash programming dynamics along PE cycling

J Coignus, A Vernhet, G Reimbold… - 2015 IEEE …, 2015 - ieeexplore.ieee.org
A novel Flash endurance characterization approach is presented, allowing delay-free READ
operations and thus a realistic electrostatic description at each cycle before any device …

A new method for quickly evaluating reversible and permanent components of the BTI degradation

X Garros, A Subirats, G Reimbold… - 2018 IEEE …, 2018 - ieeexplore.ieee.org
A new method denoted SRP is proposed to quickly evaluate reversible and permanent
components responsible for BTI degradation. It is based on a particular normalization of …

Characterization and modeling of NBTI permanent and recoverable components variability

D Nouguier, G Ghibaudo, X Federspiel… - 2016 IEEE …, 2016 - ieeexplore.ieee.org
In this paper we use a statistical analysis of NBTI stress and recoverable components
measured on Pfet devices issued from ST Microelectronics 28nm FDSOI technology. NBTI …

Analysis of functional errors produced by long-term workload-dependent BTI degradation in ultralow power processors

L Duch, M Peón-Quirós, P Weckx… - … Transactions on Very …, 2020 - ieeexplore.ieee.org
Aging effects in digital circuits change the switching characteristics of their transistors,
resulting in timing violations that can lead to functional errors at the system level. In …