The semiconductor industry is the backbone of exponentially growing digitization. Countries
from the east and the west both are investing significantly to accelerate this growth …

In recent years, significant efforts have been made in view of a transition from a linear to a
circular economy, where the value of products, materials, resources, and waste is …

During chemical mechanical polishing (CMP) for a dielectric layer, Ce 3+, which is the active
site on the surface of ceria, has a significant effect on the material removal rate (MRR). Ceria …

The design of advanced materials with superb anti-bacterial efficiency by engineering
appropriate surface properties has now become a consolidated strategy to improve the …

The thinning of the silicon wafers and the smoothening of the surface are carried out by
grinding and lapping processes. The lapping process is especially preferred to produce less …

In this study, fully cured low-temperature polyimide (PI) films and< 1 1 1>,< 1 1 0>,< 2 0 0>,
and< 2 1 1>-oriented Cu films on Si wafers were chosen to investigate the grinding effect on …

For the last 60 years, the development of cutting-edge semiconductor devices has strongly
emphasized scaling; the effort to scale down current CMOS devices may well achieve the …

Standardized measurements of vitrinite reflectance vary significantly between different
measuring institutions. The only systematically adjustable influence factor on these …

Objectives. This study assessed the effect of immersion in acidic solutions and sodium
fluoride on surface roughness of dental ceramics. Materials and Methods. 40 blocks of …

Nanostructured boron-doped diamond (BDD) offers a sizeable ion-accessible area, high
mechanical robustness, and high electrical conductivity, and could be a suitable electrode …