The present invention provides a proximity micro-electro mechanical system (MEMS) device
that utilizes a gaseous capacitive gap. The MEMS comprises a Second electrode …

Abstract A Micro-Electromechanical Systems (MEMS) device (100) having conductively filled
vias (141). A MEMS component (124) is formed on a substrate (110). The substrate has …

(57) ABSTRACT A bistable structure provided by the invention is character ized as including
a deflection element that has mechanically constrained end points and a compliant Span …

An interferometric modulator is formed by a stationary layer and a mirror facing the stationary
layer. The mirroris movable between the undriven and driven positions. Landing pads …

Abstract A Micro Electro-Mechanical System (MEMS) switch (100) having a bottom electrode
(116) formed over a substrate (112) and a thin protective cap layer (130) disposed over the …

(74) Attorney, Agent, or Firm-Parsons & Goltry; Robert A. Parsons; Michael W. Goltry (57)
ABSTRACT A method of forming a hermetically sealed MEMS package includes a step of …

The organic MEMS according to the present invention comprises a polymeric substrate
comprising a substrate surface including a first region and a second region. A polymer …

A process comprises reducing the thickness of a substrate carrying a plurality of devices,
with at least certain of the devices having a micro-machined mesh. A carrier wafer is …

A switch for use in various applications, including downhole applications, includes a first
conductor and a second conductor and an insulator electrically isolating the first and second …

Methods of fabricating a microelectromechanical systems (MEMS) device With reduced
masking and MEMS devices formed by the same are disclosed. In one embodiment, a …