On hardware security and trust for chiplet-based 2.5 D and 3D ICs: Challenges and Innovations

S Juan, A Fady, P Anthony, R Philippe - IEEE Access, 2024 - ieeexplore.ieee.org
The relentless pace of transistor miniaturization has enabled developers to continuously
increase chip complexity since the beginning of the information age. However, as transistors …

DHRCA: A Design of Security Architecture Based on Dynamic Heterogeneous Redundant for System on Wafer

B Mei, Z Zhu, P Li, B Zhao - IET Information Security, 2024 - Wiley Online Library
System on Wafer (SoW) based on chiplets may be implanted with hardware Trojans (HTs)
by untrustworthy third‐party chiplet vendors. However, traditional HTs protection techniques …

3D IC Integration Using Blockchain

R Radeep Krishna, P Sivakumar, CG Abraham… - Proceedings of 3rd …, 2023 - Springer
Abstract Three-dimensional (3D) integrated circuit (IC) contains multiple layers with active
devices, to intensely improve the chip performance, device density, and functionality …

Cyber-Physical Risks for Advanced Reactors

R Fasano, A Hahn, J James, C Lamb, A Haddad - 2021 - osti.gov
Cybersecurity for industrial control systems is an important consideration that advance
reactor designers will need to consider. How cyber risk is managed is the subject of on …