A CMOS inverter driven equivalent single conductor model of capacitively coupled mixed
CNT bundle (MCB) interconnects are taken to analyze the crosstalk induced time domain …

In order to solve the electrical performance limitations of horizontal multilayer graphene
nanoribbon (H-MLGNR) based interconnect, a new geometric structure of vertical multilayer …

Future multichip packages require Die-to-Die (D2D) interconnects operating at frequencies
above 10 GHz; however, the extension of copper interconnects and epoxy dielectrics …

为了解决高频柔性通信系统中导体表面粗糙度制约传输性能的问题, 提出了一种柔性分段共面
波导传输线结构, 采用梯度模型分析了均方根粗糙度Rq 对该传输线损耗特性的影响 …

With the demand for more powerful functions and miniaturization of electronic equipment,
the requirements for complex interconnection design and manufacturing in electronic …

This study examines the surface morphology, density and relative dielectric constant of three
formulations of HDPE/NR prior to further development of HDPE/NR/Empty Fruit Bunch …

A method for modeling the interconnection and signal transmission performance of double
bond ribbons with configuration variation has been proposed. Arc interval function …

In this chapter, we discuss the important role played by high-speed on-chip, that is,
nanoscale interconnects in the design of integrated circuits and systems. Losses and …

High‐speed metal interconnects play a significant role in the on‐chip network system as the
network performance largely depends on the behaviour of these interconnects. Variability in …

As a bridge between circuit modules, microwave circuit interconnection not only needs to
meet the reliability of mechanical connection, but also needs to ensure the complete …