Provided is a vertical accelerometer for measuring acceleration applied perpendicular to a
substrate to increase sensitivity thereof. The vertical accelerometer includes a substrate, and …

(51) Int. Cl.(57) ABSTRACT GOIP 5/25(2006.01) A transducer (20) includes sensors (28, 30)
that are bonded to GOIP3/04(2006.01) form a vertically integrated configuration. The sensor …

(57) ABSTRACT Related US Application Data An electrostatic actuator/transducer has a
comb driver and can be adapted for a variety of applications, particularly as a (60) …

(57) ABSTRACT A micromechanical pressure sensor device includes: an MEMS wafer
having a front side and a rear side; a first micromechanical functional layer formed above the …

A microelectromechanical systems (MEMS) pressure sensor device (20, 62) includes a
substrate structure (22, 64) having a cavity (32, 68) formed therein and a substrate structure …

Int. Cl.(57) G06F I7/00(2006.01) Integrated crash and vehicle movement sensing by use of
(52) US Cl. distributed new multi-axis satellite sensors combines side …

Microelectromechanical systems (MEMS) devices are semiconductor devices with
embedded mechanical compo nents. MEMS devices include, for example, pressure …

(57) ABSTRACT A microelectromechanical systems (MEMS) sensor (20) includes a
substrate (26) and suspension anchors (34, 36) formed on a planar surface (28) of the …

Fabrication methods are provided for a sensor device packages. An exemplary fabrication
method involves bonding a sensor structure and another structure using a sealing structure …

BACKGROUND Microelectromechanical systems (MEMS) are widely used in a variety of
sensing applications. For example, a MEMS pressure sensor may be implemented on a …