Recent progress and challenges regarding carbon nanotube on-chip interconnects

B Xu, R Chen, J Zhou, J Liang - Micromachines, 2022 - mdpi.com
Along with deep scaling transistors and complex electronics information exchange networks,
very-large-scale-integrated (VLSI) circuits require high performance and ultra-low power …

Properties, applications, and prospects of carbon nanotubes in the construction industry

S Yang - Architecture, Structures and Construction, 2023 - Springer
Nanotechnology and nanomaterials have offered sustainable design options for the built
environment and enabled architects to design more flexible architectural forms. Carbon …

Raman Signatures of Broken Inversion Symmetry and In‐Plane Anisotropy in Type‐II Weyl Semimetal Candidate TaIrTe4

Y Liu, Q Gu, Y Peng, S Qi, N Zhang, Y Zhang… - Advanced …, 2018 - Wiley Online Library
The layered ternary compound TaIrTe4 is an important candidate to host the recently
predicted type‐II Weyl fermions. However, a direct and definitive proof of the absence of …

Temperature-dependent modeling and performance evaluation of multi-walled CNT and single-walled CNT as global interconnects

K Singh, B Raj - Journal of Electronic Materials, 2015 - Springer
The influence of temperature on multi-walled carbon nanotube (MWCNT) interconnects
have been studied. A temperature-dependent equivalent circuit model is presented for the …

Influence of temperature on MWCNT bundle, SWCNT bundle and copper interconnects for nanoscaled technology nodes

K Singh, B Raj - Journal of Materials Science: Materials in Electronics, 2015 - Springer
This paper presents the comparative analysis of temperature dependent performance of
Multi-walled carbon nanotubes (MWCNT), Single-walled carbon nanotube (SWCNT) and …

Performance and analysis of temperature dependent multi-walled carbon nanotubes as global interconnects at different technology nodes

K Singh, B Raj - Journal of Computational Electronics, 2015 - Springer
A temperature dependent performance in terms of power delay product (PDP) of multi-
walled carbon nanotube (MWCNT) bundle interconnect has been analyzed for temperature …

Temperature-dependent modeling and crosstalk analysis in mixed carbon nanotube bundle interconnects

MK Rai, H Garg, BK Kaushik - Journal of Electronic Materials, 2017 - Springer
The temperature-dependent circuit modeling and performance analysis in terms of crosstalk
in capacitively coupled mixed carbon nanotube bundle (MCB) interconnects, at the far end …

Temperature‐dependent modeling and performance analysis of coupled MLGNR interconnects

MK Rai, S Arora, BK Kaushik - International journal of circuit …, 2018 - Wiley Online Library
The temperature‐dependent circuit modeling and performance in terms of propagation
delay, power dissipation, and crosstalk‐induced voltage waveform at the far end of victim …

Dielectric surface roughness scattering induced crosstalk performance of coupled MCB interconnects

M Sharma, MK Rai, R Khanna - Microelectronics Journal, 2021 - Elsevier
A CMOS inverter driven equivalent single conductor model of capacitively coupled mixed
CNT bundle (MCB) interconnects are taken to analyze the crosstalk induced time domain …

Effect of temperature on the performance analysis of MLGNR interconnects

T Kaur, MK Rai, R Khanna - Journal of Computational Electronics, 2019 - Springer
Multi-layer graphene nanoribbons (MLGNR) have been proposed as a possible
interconnect material. Based on an equivalent single-conductor model of an intercalation …