Effect of critical properties of epoxy molding compound on warpage prediction: A critical review

SP Phansalkar, C Kim, B Han - Microelectronics Reliability, 2022 - Elsevier
For the past couple of decades, a considerable amount of time and effort has been spent to
enhance the predictability of warpage of semiconductor packages encapsulated by epoxy …

Accuracy of CMOS-based piezoresistive stress sensor for engineering applications of thermal loading condition: Theoretical review and experimental validation

A Prisacaru, A Palczynska, P Gromala… - IEEE Sensors …, 2019 - ieeexplore.ieee.org
Measurement uncertainties of a CMOS-based piezoresistive stress sensor are studied for
low cycle thermal loading applications. After the fundamentals of the sensor are reviewed …

Degradation estimation and prediction of electronic packages using data-driven approach

A Prisacaru, P Gromala, B Han… - IEEE transactions on …, 2021 - ieeexplore.ieee.org
Recent trends in automotive electronics such as automated driving will increase the number
and complexity of electronics used in safety-relevant applications. Applications in logistics or …

A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles

A Matallana, E Robles, E Ibarra, J Andreu… - Microelectronics …, 2019 - Elsevier
Current environmental concerns and fuel scarcity are leading to the progressive introduction
of Electric Vehicles (EV) in the global fleet vehicle population. This requires significant …

[PDF][PDF] 基于多模型耦合的电动汽车三电系统安全性估计方法

李达, 张普琛, 林倪, 张照生, 王震坡, 邓钧君 - 机械工程学报, 2023 - qikan.cmes.org
电动汽车动力电池, 驱动电机和电控系统的安全性对于车辆的正常运行和乘员的生命财产安全至
关重要. 提出一种多模型耦合的电动汽车三电系统安全性估计方法. 该方法仅需要实车传感器 …

A feasibility study on potential of stress sensors to detect solder joint defects toward prognostics of power modules

M Usui, M Kuwahara, T Satoh - Microelectronics Reliability, 2022 - Elsevier
The superiority of stress sensors over temperature sensors for detecting defects in solder
joints was investigated. The effects of joint defects on device stress and temperature in a …

Prediction of Defect Distribution in Solder Joint Using Device Stress toward Prognostic Health Management of Power Modules

M Usui, M Kuwahara, R Okachi… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Predicting the solder joint degradation is an important technique that has a significant impact
on the reliability of power modules, with the potential to estimate the remaining service life …

Concept of the 3rd Generation of Reliability for Electronic Smart Systems

P Gromala, F Dietz, S Rzepka… - 2019 18th IEEE …, 2019 - ieeexplore.ieee.org
We present a novel approach for reliability assessment of the future electronic control units
and smart systems. This concept of 3 rd generation reliability is based on application of …

In-situ service load monitoring of automotive electronic systems using silicon-based piezoresistive stress sensor

YH Yang, B Han, A Prisacaru, P Gromala… - Microelectronics …, 2020 - Elsevier
It is expected that more and more complex (integrated) automotive electronics will be
adopted in systems. These advanced electronics are critical for passenger safety …

[PDF][PDF] Safety Estimation Method of Electric System in Electric Vehicles Based on Multiple Model Coupling

李达, 张普琛, 林倪, 张照生, 王震坡… - Journal of Mechanical …, 2023 - qikan.cmes.org
The safety of power battery, drive motor and electronic control system is essential for the
normal operation of electric vehicles and the safety of occupant's life and property. A novel …