Dielectric surface roughness scattering induced crosstalk performance of coupled MCB interconnects
A CMOS inverter driven equivalent single conductor model of capacitively coupled mixed
CNT bundle (MCB) interconnects are taken to analyze the crosstalk induced time domain …
CNT bundle (MCB) interconnects are taken to analyze the crosstalk induced time domain …
Delay characterization of multilayer graphene nanoribbon interconnects in presence of scattering and thermal effects
Scattering source‐based mean free path (MFP) and circuit modeling are proposed for three
different configurations of undoped multilayer graphene nanoribbon (U‐MLGNR)(viz …
different configurations of undoped multilayer graphene nanoribbon (U‐MLGNR)(viz …
High-frequency characteristics of multilayer graphene nanoribbon interconnects: Exploring the implications OF SKIN effect
A study is undertaken to explore the frequency-dependent traits of crosstalk delay (XD),
crosstalk noise area (X-NA), and the mean time to failure induced by electromigration (EM …
crosstalk noise area (X-NA), and the mean time to failure induced by electromigration (EM …
Fast Multi-ANN Composite Models for Repeater Optimization in Presence of Parametric Uncertainty for on-Chip Hybrid Copper-Graphene Interconnects
In this paper, composite models are developed to predict the statistics of the optimal number
and size of repeaters required to minimize the power delay product (PDP) of on-chip hybrid …
and size of repeaters required to minimize the power delay product (PDP) of on-chip hybrid …
An artificial neural network surrogate model for repeater optimization in the presence of parametric uncertainty for hybrid copper-graphene interconnect networks
A Sharif, S Pathania, S Kushwaha… - 2022 IEEE MTT-S …, 2022 - ieeexplore.ieee.org
In this paper, an artificial neural network model is developed to predict the statistics of the
optimal number and size of repeaters required to minimize the power delay product (PDP) of …
optimal number and size of repeaters required to minimize the power delay product (PDP) of …
Temperature-aware compact modeling for resistivity in ultra-scaled Cu-graphene hybrid interconnects
Due to highly-scaled feature sizes of on-chip interconnects at advanced technology nodes,
size effects dominate the conductor losses. Also, the surface roughness effects in Cu …
size effects dominate the conductor losses. Also, the surface roughness effects in Cu …
Impact of Technology Scaling in DSM Region on Performance of Intercalation-doped MLGNR as VLSI Interconnects
Intercalation-doped multilayer graphene nano-ribbons (ID-MLGNR) have been proposed as
a potential contender for interconnect applications. In the present research work, the impact …
a potential contender for interconnect applications. In the present research work, the impact …
Performance analysis of MCB-based VLSI interconnects depending on scattering induced by substrate surface roughness
An equivalent single-conductor model is developed for all possible structures of mixed
carbon nanotube bundle interconnects at the 14-nm technology node. The results are …
carbon nanotube bundle interconnects at the 14-nm technology node. The results are …
[PDF][PDF] Study of Electromigration in Integrated Circuits at Design Level Estudo da Eletromigração em Circuitos Integrados na Fase de Projeto
RO Nunes - 2020 - repositorio.unicamp.br
Electromigration damage in interconnects is a well-known bottleneck of integrated circuits,
because it causes reliability problems. Operation at high temperatures and current densities …
because it causes reliability problems. Operation at high temperatures and current densities …