Optimization of Core Material Properties for Large Flip-chip Ball Grid Array Substrate to Manage Both Warpage and Board Level Reliability
H Noma, M Takahashi, N Hatakeyama… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
A large silicon chip or interposer is mounted onto a large package substrate using flip-chip
for high performance computing (HPC) such as artificial intelligence (AI) and fifth generation …
for high performance computing (HPC) such as artificial intelligence (AI) and fifth generation …
Low Temperature Soldering of 3D Printed Conductive Polymer Contacts
M Ralchev, V Mateev, I Marinova - 2023 15th Electrical …, 2023 - ieeexplore.ieee.org
In this work low-temperature soldering of 3D printed conductive polymer contacts is
presented. Soldering is widely used method for making electrical joints. Here it is …
presented. Soldering is widely used method for making electrical joints. Here it is …