A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS
wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric …

Embodiments of the present disclosure include MEMS devices and methods for forming
MEMS devices. An embodiment is a method for forming a microelectromechanical system …

An integrated MEMS device comprises a wafer where the wafer contains two or more
cavities of different depths. The MEMS device includes one movable structure within a first …

BACKGROUND 0003. Many MEMS devices, specifically those measuring or modifying
aspects of the environment outside of the device (eg pressure sensors, microphones …

Some embodiments relate to multiple MEMS devices that are integrated together on a single
Substrate. A device Substrate comprising first and second micro-electro mechanical system …

Micromachined ultrasonic transducers integrated with complementary metal oxide
semiconductor (CMOS) sub strates are described, as well as methods of fabricating such …

Micromachined ultrasonic transducers integrated with complementary metal oxide
semiconductor (CMOS) sub strates are described, as well as methods of fabricating such …

A method for fabricating a MEMS device includes providing a micro-electro-mechanical
system (MEMS) substrate having a sacrificial layer on a first side, providing a carrier …

The present disclosure relates to a method of forming a plu rality of MEMs device having a
plurality of cavities with different pressures on a wafer package system, and an asso ciated …

An integrated MEMS device comprises two substrates where the first and second substrates
are coupled together and have two enclosures there between. One of the first and second …