The escalating adoption of multi-chips configurations in integrated circuits has intensified
concerns about power density and heat generation. Inadequate chip layout design can lead …

Rapid prediction of structural temperature fields based on limited measurements is crucial
for the real-time thermodynamic analysis and thermal management of industrial equipment …

The introduction of silicon carbide (SiC) has reduced the superiority of traditional silicon-
based power module pack-aging strategies. As packaging strategies become increasingly …

This work proposes a novel surrogate model (noted as HCP-PIGN) combining two groups of
neural networks: ie, the physics-informed and the graph convolutional neural networks …

Obtaining the steady-state temperature distribution of FPGA chip is the basis to build the
thermal monitoring mechanism for reliable system performance. Existing work employs the …

This paper investigates the optimization of the inner thermal layout in nanofluid-filled
horizontal annular pipes under natural convection conditions. Two-dimensional models of …

With the rapid development of artificial intelligence technology, representation-supervised
neural networks have been widely used in the fast solution of physical field. However, a …