The development of microelectronics and large-scale intelligence nowadays promotes the
integration, miniaturization, and multifunctionality of electronic and devices but also leads to …

With the burgeoning of the microelectronics industry, in order to improve the transmission
speed between chips in large-scale integrated circuits to meet the demands of high …

Thermoplastic polyimides (TPIs) have melt‐processability and adhesive ability, besides the
intrinsic advantages of polyimides. To meet the requirements of applications in high …

Ultralow‐k materials with promising comprehensive performance to meet the increasing
requirements of high‐frequency communication are highly desired. Here, a cross‐linked …

Polyimide (PI) has been extensively used in 5G microelectronics however the relatively high
dielectric constant (∼ 3.5) and moisture adsorption have greatly limit its practical …

Polyimide (PI) with ultralow dielectric constant (D k) and dielectric loss (D f) is highly desired
for high-frequency and high-speed electromagnetic communications. Herein, PI fm/PI …

As 5G technology rapidly progresses, the demand for insulating dielectric materials with low
dielectric constants, minimal dielectric loss, and enhanced thermal and mechanical …

With the increasing demand for high‐performance printed circuit boards (PCBs) in the 6G
communication era, dielectric substrate materials must exhibit a low dielectric constant (Dk) …

The continuous upgrading of electronic technology has facilitated the integration and
miniaturization of electronic and electrical equipment, as well as putting great pressure on …

A series of transparent crosslinked colorless polyimide (CPI) films are prepared from 3, 3′,
4, 4′-biphenyltetracarboxylic dianhydride (BPDA), 2, 2′-bis (trifluoro-methyl) benzidine …