Apparatus and methods are described that include ultrasound imaging devices, which may
operate in a transmissive ultrasound imaging modality, and which may be used to detect …

Ultrasound devices and methods are described, including a repeatable ultrasound
transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable …

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be
employed in the receive signal path to reduce data bandwidth and a high-speed serial data …

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be
employed in the receive signal path to reduce data bandwidth and an output data module …

Micromachined ultrasonic transducers integrated with complementary metal oxide
semiconductor (CMOS) substrates are described, as well as methods of fabricating such …

The integrated circuit/transducer device of the preferred embodiment includes a substrate, a
complementary-metal-oxide-semiconductor (CMOS) circuit that is fabricated on the …

Complementary metal oxide semiconductor (CMOS) ultra sonic transducers (CUTs) and
methods for forming CUTs are described. The CUT's may include monolithically integrated …

CMOS Ultrasonic Transducers and processes for making such devices are described. The
processes may include forming cavities on a first wafer and bonding the first wafer to a …

The first integrated circuit/transducer device 36 of the handheld probe includes CMOS
circuits 110 and cMUT elements 112. The cMUT elements 112 function to generate an …

Aspects of the technology described herein relate to ultra Sound device circuitry as may form
part of a single Substrate ultrasound device having integrated ultrasonic transducers. The …