Bottom-up Cu filling of annular through silicon vias: Microstructure and texture

SH Kim, HJ Lee, D Josell, TP Moffat - Electrochimica Acta, 2020 - Elsevier
Microstructural and morphological evolution during bottom-up Cu filling of annular through
silicon vias (TSV) in a CuSO 4–H 2 SO 4–Cl-–poloxamine electrolyte is examined …

Self‐Organization in Electrochemical Synthesis as a Methodology towards New Materials

MR Pinto, GF Costa, EG Machado… - ChemElectroChem, 2020 - Wiley Online Library
Despite its potential, self‐organization as a methodology for the synthesis of materials has
not been developing at the pace required for the ample scale synthesis of materials with …

Electrochemical oscillations during copper electrodissolution in hydrochloric acid solution

L Ding, Z Song, P Wu, J Cheng, C Chen, Y Niu… - International Journal of …, 2019 - Elsevier
The electrodissolution process of copper anode is widely used in industrial copper-
processing, such as electrolysis, electroplating, electrocatalysis, corrosion, and electric …

Quasiperiodic behavior in the electrodeposition of Cu/Sn multilayers: extraction of activation energies and wavelet analysis

L Menezes, E Parma, EG Machado… - Physical Chemistry …, 2019 - pubs.rsc.org
Living systems are one of the many examples in which self-organizing systems yield more
intricate structures than those that can be achieved using a “step-by-step” approach. This …

Desenvolvimento de software e interface para o controle por retroalimentação atrasada em sistemas eletroquímicos

E Parma, L Menezes, SA Baldin, R Nagao - Química Nova, 2021 - SciELO Brasil
In this paper, we show the development of a LabVIEW algorithm able to apply the delayed
feedback control on oscillatory electrochemical reactions. The coupling of the control and …

[PDF][PDF] Instabilities during electrochemical deposition of Sn-Co alloys from gluconate/sulphate electrolyte

TT Valkova, IN Krastev - Bulg Chem Commun, 2018 - bcc.bas.bg
Dull coatings with high cobalt content can be deposited from the investigated electrolyte.
Depending on tin concentration, the deposition of coatings with cobalt content in the range …

Bistability induced by the presence of 1, 10-phenanthroline in the electrodeposition of copper= Bistabilidade induzida pela presença da 1, 10-fenantrolina na …

MR Pinto - 2019 - repositorio.unicamp.br
É estudado em detalhe o efeito inibitório na reação de eletrodeposição de cobre causado
pela adsorção da 1, 10-fenantrolina (phen), uma molécula N-heterocíclica, sobre a …

[PDF][PDF] MARIA RODRIGUES PINTO

BIPP DA - researchgate.net
The inhibiting effect in the electrodeposition of copper resulted from the adsorption of 1, 10-
phenanthroline (phen), an N-heterocyclic organic molecule, on metallic copper surface due …

Experimental and Model Spatiotemporal and Spatial Patterns in Electrochemical Systems

M Orlik, M Orlik - Self-Organization in Electrochemical Systems II …, 2012 - Springer
Simple examples of pattern formation in electrochemistry, including progress of active zone
along the passivated iron wire, mimicking the conduction of the impulse along the neuron …

[引用][C] Periodic Nanostructures

I Krastev, T Dobrovolska - 2017 - Elsevier