An embedded component device includes an electronic component including an electrical
contact, an upper patterned conductive layer, a dielectric layer between the upper patterned …

(57) ABSTRACT A semiconductor package includes at least one semiconduc tor die having
an active Surface, an interposer element having an upper Surface and a lower Surface, a …

US8339802B2 - Module having a stacked magnetic device and semiconductor device and
method of forming the same - Google Patents US8339802B2 - Module having a stacked …

A method (32) of packaging integrated circuit (IC) dies (48) includes applying (36) a
laminating material (44) to a wafer (40), and separating (46) the wafer (40) into multiple IC …

Microelectronic assemblies, related devices and methods, are disclosed herein. In some
embodiments, a microelec tronic assembly may include a package substrate having a first …

A micromagnetic device includes a first insulating layer formed above a substrate, a first
seed layer formed above the first insulating layer, a first conductive winding layer selectively …

A semiconductor package includes a substrate unit, a die electrically connected to first
contact pads, and a package body covering a first patterned conductive layer and the die …

(57) ABSTRACT A component built-in wiring board is provided. The compo nent built-in
wiring board 10 includes a core substrate 11, a first component 61, a first built-up layer 31 …

(57) ABSTRACT A power converter and method of controlling the same for selected modes
of operation. In one embodiment, the power converter includes a first power switch coupled …

US8320134B2 - Embedded component substrate and manufacturing methods thereof -
Google Patents US8320134B2 - Embedded component substrate and manufacturing methods …