Connection components with frangible leads and bus
TH DiStefano, GW Grube, IY Khandros… - US Patent …, 2000 - Google Patents
57 ABSTRACT A connection component for electrically connecting a Semi conductor chip to
a Support Substrate incorporates a prefer ably dielectric Supporting structure defining gaps …
a Support Substrate incorporates a prefer ably dielectric Supporting structure defining gaps …
Methods of making semiconductor connection components with releasable load support
TH DiStefano, GW Grube, IY Khandros… - US Patent …, 1998 - Google Patents
A connection component for electrically connecting a semiconductor chip to a support
substrate incorporates a preferably dielectric supporting structure defining gaps. Leads …
substrate incorporates a preferably dielectric supporting structure defining gaps. Leads …
System and method for graphically displaying ontology data
S Gardner, M Eldridge, B Davis - US Patent App. 11/122,021, 2006 - Google Patents
One form of knowledge representation may comprise a list representing all available values
for a given subject. For example, knowledge in the area of “human body tissue types” may …
for a given subject. For example, knowledge in the area of “human body tissue types” may …
Enhanced compliant probe card systems having improved planarity
JM Haemer, FC Chong, DN Modlin - US Patent 7,349,223, 2008 - Google Patents
2010-07-07 Assigned to NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF
CREDITORS), LLC reassignment NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF …
CREDITORS), LLC reassignment NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF …
High density interconnect system for IC packages and interconnect assemblies
WR Bottoms, FC Chong, S Mok, D Modlin - US Patent 7,579,848, 2009 - Google Patents
An improved interconnection system is described, such as for electrical contactors and
connectors, electronic device or module package assemblies, socket assemblies, and/or …
connectors, electronic device or module package assemblies, socket assemblies, and/or …
Semiconductor connection components and methods with releasable lead support
TH DiStefano, GW Grube, IY Khandros… - US Patent …, 1999 - Google Patents
A connection component for electrically connecting a semiconductor chip to a support
substrate incorporates a preferably dielectric supporting structure defining gaps. Leads …
substrate incorporates a preferably dielectric supporting structure defining gaps. Leads …
Systems for testing and packaging integrated circuits
S Mok, FC Chong, R Milter - US Patent 7,621,761, 2009 - Google Patents
Several embodiments of stress metal springs are disclosed, which typically comprise a
plurality of stress metal layers that are established on a substrate, which are then …
plurality of stress metal layers that are established on a substrate, which are then …
Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication
HD Thacker, OO Ogunsola, JD Meindl - US Patent 7,348,786, 2008 - Google Patents
BACKGROUND In the current manufacture of semiconductor devices, functionality of
electrical devices is verified at the wafer level by automated test equipment using probe …
electrical devices is verified at the wafer level by automated test equipment using probe …
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
S Mok, FC Chong - US Patent 6,815,961, 2004 - Google Patents
Several embodiments of integrated circuit probe card assemblies are disclosed, which
extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that …
extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that …
High density interconnect system having rapid fabrication cycle
FC Chong, A Kao, D McKay, A Litza, D Modlin… - US Patent …, 2008 - Google Patents
An improved interconnection system and method is described, such as for connectors,
socket assemblies and/or probe card systems. An exemplary system comprises a probe card …
socket assemblies and/or probe card systems. An exemplary system comprises a probe card …