Increasing data rates, spectrum efficiency, and energy efficiency have been driving major
advances in the design and hardware integration of RF communication networks. In order to …

With the continuous reduction of chip feature size, the continuation of Moore's Law becomes
increasingly difficult and heterogeneous integration has become one of the important …

Thermal metamaterials exhibit thermal properties that do not exist in nature but can be
rationally designed to offer unique capabilities of controlling heat transfer. Recent advances …

Fan-out wafer/panel level package (PLP) is an advanced package. Compared to the
conventional package, its thickness is reduced, and electrical and thermal characteristics …

Abstract 3D integration [,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,–] consists of at least 3D IC
integration and 3D IC packaging. First of all, by definition, both 3D IC integration and 3D IC …

Applications including artificial intelligence, 5G mobile communication, and virtual reality
require a large amount of computations, wide bandwidth, and high-speed data …

Recently, the power density has been increasing due to the high bandwidth of 5G mobile
devices and it leads to temperature rise. Increased temperature reduces lifetime by quality …

The pursuit of higher packing density has propelled the shift towards three-dimensional (3D)
integrated circuits (3D-ICs), promising heightened performance, accelerated data speeds …

Recently, there has been an increasing demand for performance improvement and
miniaturization in response to the growing variety of signals and power demands in many …

Since the first Fan-out Wafer Level Packaging (FOWLP) was introduced in 2001 by Infineon,
lots of technical advancements and studies related to this technology have been reported …