Dielectric properties of porous silicon for use as a substrate for the on-chip integration of millimeter-wave devices in the frequency range 140 to 210 GHz

P Sarafis, AG Nassiopoulou - Nanoscale research letters, 2014 - Springer
In this work, the dielectric properties of porous Si for its use as a local substrate material for
the integration on the Si wafer of millimeter-wave devices were investigated in the frequency …

Post-process porous silicon for 5G applications

G Scheen, R Tuyaerts, M Rack, L Nyssens… - Solid-State …, 2020 - Elsevier
The interest of 5G in centimeter and millimeter waves relies on large blocks of available
spectra and thus increased bandwidth. At these frequencies, the dielectric and conductive …

Dielectric permittivity of porous Si for use as substrate material in Si-integrated RF devices

P Sarafis, E Hourdakis… - IEEE Transactions on …, 2013 - ieeexplore.ieee.org
Dielectric permittivity of porous Si (PSi) layers formed on a low-resistivity p-type Si (0.001-
0.005 Ω. cm) is thoroughly investigated using analytical expressions within the frame of …

Beyond-CMOS Nanodevices 1

F Balestra - 2014 - books.google.com
This book offers a comprehensive review of the state-of-the-art in innovative Beyond-CMOS
nanodevices for developing novel functionalities, logic and memories dedicated to …

Small-and large-signal performance up to 175° C of low-cost porous silicon substrate for RF applications

M Rack, Y Belaroussi, KB Ali, G Scheen… - … on Electron Devices, 2018 - ieeexplore.ieee.org
This paper focuses on the comparison of the RF performances of various advanced trap-rich
(TR) siliconon-insulator (SOI) and porous silicon (PSi) substrates. The PSi substrates are …

Hybrid precoding with time-modulated arrays for mmwave MIMO systems

JP González-Coma, R Maneiro-Catoira… - IEEE Access, 2018 - ieeexplore.ieee.org
We consider the utilization of time-modulated arrays (TMAs) as a simple and cost-effective
approach to hybrid digital–analog precoding in millimeter wave (mmWave) multiple-input …

Porous Si as a substrate for the monolithic integration of RF and millimeter-wave passive devices (transmission lines, inductors, filters, and antennas): Current state-of …

P Sarafis, AG Nassiopoulou - Applied Physics Reviews, 2017 - pubs.aip.org
The increasing need for miniaturization, reliability, and cost efficiency in modern
telecommunications has boosted the idea of system-on-chip integration, incorporating the …

Advanced Si-based substrates for RF passive integration: Comparison between local porous Si layer technology and trap-rich high resistivity Si

P Sarafis, E Hourdakis, AG Nassiopoulou, CR Neve… - Solid-state …, 2013 - Elsevier
In this work, two novel RF substrate technologies are compared, namely local porous Si RF
substrate technology and high resistivity Si with a trap-rich layer on top (trap-rich HR-Si) …

High-performance on-chip low-pass filters using CPW and slow-wave-CPW transmission lines on porous silicon

P Sarafis, AG Nassiopoulou, H Issa… - IEEE Transactions on …, 2015 - ieeexplore.ieee.org
We report on the design, fabrication, and characterization of high-performance stepped-
impedance filters (SIFs) on a locally formed porous Si layer on the CMOS Si wafer. This …

High-performance MIM capacitors with nanomodulated electrode surface

E Hourdakis, A Travlos… - IEEE Transactions on …, 2015 - ieeexplore.ieee.org
We report on a high-performance metal-insulator-metal (MIM) capacitor using a barrier-type
anodic alumina as dielectric and exhibiting a capacitance density as high as 10 fF/μm 2 with …