Wire bonding is still the most popular chip interconnect technology in microelectronic
packaging and will not be replaced by other interconnect methods for a long time in the …

Chapter 1 gives an introduction to Cu wire bonding technology. The advantages of Cu over
Au, such as lower cost, higher mechanical strength, and higher electrical and thermal …

In this work, in order to provide theoretical data for further research on preparing AuAl 2 alloy
to screen suitable elements that can improve the ductility of AuAl 2, the first-principles …

Vacuum and hermetic packaging is a critical requirement for optimal performance of many
micro-electromechanical systems (MEMS), vacuum electronics, and quantum devices …

Developing fast and accurate methods to discover intermetallic compounds is relevant for
alloy design. While density-functional-theory (DFT)-based methods have accelerated design …

In this study, trace quantities of silver, palladium, and gold were added to 5 N pure copper
wires to prepare microalloyed copper (MAC) wires. The mechanical properties and electrical …

Wire bonding is the predominant mode of interconnection in microelectronic packaging.
Gold wire bonding has been refined again and again to retain control of interconnect …

Abstract Ag–8Au–3Pd alloy wire has shown promise as an economical substitute for gold
wire interconnects from integrated circuits to substrates. This work is undertaken to gain a …

Wire bonding on Al pad packages with an innovative annealing twinned Ag-8Au-3Pd alloy
wire results in a sufficient interfacial intermetallic layer at the initial as-bonded stage, while …

The kinetics of diffusion and formation of Al-Au intermetallic compounds in a solid-state
reaction between layers of aluminum and gold has been studied by the method of in situ …