Recent advances in GaN‐based power HEMT devices

J He, WC Cheng, Q Wang, K Cheng… - Advanced electronic …, 2021 - Wiley Online Library
The ever‐increasing power density and operation frequency in electrical power conversion
systems require the development of power devices that can outperform conventional Si …

Reliability, applications and challenges of GaN HEMT technology for modern power devices: A review

N Islam, MFP Mohamed, MFAJ Khan, S Falina… - Crystals, 2022 - mdpi.com
A new generation of high-efficiency power devices is being developed using wide bandgap
(WBG) semiconductors, like GaN and SiC, which are emerging as attractive alternatives to …

Controlling surface/interface states in GaN-based transistors: Surface model, insulated gate, and surface passivation

JT Asubar, Z Yatabe, D Gregusova… - Journal of Applied …, 2021 - pubs.aip.org
Controlling surface/interface states in GaN-based transistors: Surface model, insulated gate,
and surface passivation | Journal of Applied Physics | AIP Publishing Skip to Main Content …

GaN HEMT reliability

JA del Alamo, J Joh - Microelectronics reliability, 2009 - Elsevier
This paper reviews the experimental evidence behind a new failure mechanism recently
identified in GaN high-electron mobility transistors subject to electrical stress. Under high …

Insulated gate and surface passivation structures for GaN-based power transistors

Z Yatabe, JT Asubar, T Hashizume - Journal of Physics D …, 2016 - iopscience.iop.org
Recent years have witnessed GaN-based devices delivering their promise of
unprecedented power and frequency levels and demonstrating their capability as an able …

State of the art on gate insulation and surface passivation for GaN-based power HEMTs

T Hashizume, K Nishiguchi, S Kaneki, J Kuzmik… - Materials science in …, 2018 - Elsevier
In this article, we review recent progress on AlGaN/GaN and InAlN/GaN metal-insulator-
semiconductor high-electron-mobility transistors (MIS-HEMTs) using Al-based oxides, nitride …

Silicon substrate removal of GaN DHFETs for enhanced (< 1100 V) breakdown voltage

P Srivastava, J Das, D Visalli, J Derluyn… - IEEE Electron …, 2010 - ieeexplore.ieee.org
In this letter, we present a novel approach to enhance the breakdown voltage (V_\rmBD) for
AlGaN/GaN/AlGaN double-heterostructure FETs (DHFETs), grown by metal–organic …

CMOS process-compatible high-power low-leakage AlGaN/GaN MISHEMT on silicon

M Van Hove, S Boulay, SR Bahl… - IEEE Electron …, 2012 - ieeexplore.ieee.org
We report on a novel Au-free CMOS process-compatible process for AlGaN/GaN metal-
insulator-semiconductor high-electron-mobility transistors. The process starts from a 150 …

Recent advances on dielectrics technology for SiC and GaN power devices

F Roccaforte, P Fiorenza, G Greco, M Vivona… - Applied Surface …, 2014 - Elsevier
Silicon carbide (SiC) and gallium nitride (GaN) devices are considered as optimal solutions
to meet the requirements of the modern power electronics. In fact, they can allow an …

Investigation of In Situ SiN as Gate Dielectric and Surface Passivation for GaN MISHEMTs

H Jiang, C Liu, Y Chen, X Lu… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
In this paper, we present a systematic investigation of metal–organic chemical vapor
deposition-grown in situ SiN as the gate dielectric and surface passivation for AlGaN/GaN …