In this review, a review a of the applications of micro-Raman spectroscopy (μRS) to
characterize the residual strain and/or stress in electronic packaging is presented. Micro …

Recent trends in automotive electronics such as automated driving will increase the number
and complexity of electronics used in safety-relevant applications. Applications in logistics or …

The piezoresistive silicon based stress sensor has the potential to be part of the Digital Twin
implementation in automotive electronics. One solution to enforce reliability in digital twins is …

The superiority of stress sensors over temperature sensors for detecting defects in solder
joints was investigated. The effects of joint defects on device stress and temperature in a …

This paper reports a comprehensive study on four point bending experiment and its
correlation with numerical simulation. As test vehicle we have used a board with 16 QFN …

This article reports a comprehensive study on four point bending and temperature
experiments and their correlation with numerical simulation. The test vehicle is a printed …

Miniaturization of components and higher operating loads lead to reduced lifetimes.
Prognostics and Health Management (PHM) enables predictive maintenance of components …

Prognostics and Health Management (PHM) introduces in-situ monitoring of health
parameters to the reliability of electronics. In this paper we adopt a data-driven PHM …

It is expected that more and more complex (integrated) automotive electronics will be
adopted in systems. These advanced electronics are critical for passenger safety …

In this study, the chip-package interaction is analyzed by means of stress sensors with
electrical simulation being initially carried out to optimize the stress sensor model. The …