[HTML][HTML] Selective compositional range exclusion via directed energy deposition to produce a defect-free Inconel 718/SS 316L functionally graded material
In this research, additively manufacturing a functionally graded material (FGM) with a
compositional range of Ni-based Inconel superalloy (Inconel 718) and Fe-based stainless …
compositional range of Ni-based Inconel superalloy (Inconel 718) and Fe-based stainless …
Topography‐supported nanoarchitectonics of hybrid scaffold for systematically modulated bone regeneration and remodeling
Orthopedic implants should have sufficient strength and promote bone tissue regeneration.
However, most conventional implants are optimized for use either under high mechanical …
However, most conventional implants are optimized for use either under high mechanical …
Additive manufacturing of a shift block via laser powder bed fusion: The simultaneous utilisation of optimised topology and a lattice structure
The precise shape of a shift block support for the turbine blade of a hovercraft was additively
manufactured using 17–4 precipitation-hardened stainless steel (STS 630) powder through …
manufactured using 17–4 precipitation-hardened stainless steel (STS 630) powder through …
CALPHAD-guided alloy design of Sn–In based solder joints with multiphase structure and their mechanical properties
X Luo, J Peng, W Zhang, S Wang, S Cai… - Materials Science and …, 2022 - Elsevier
A CALPHAD-guided alloy design and the corresponding key experiments method were
performed to study the microstructure-mechanical properties relationships for Sn–In based …
performed to study the microstructure-mechanical properties relationships for Sn–In based …
The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt% Sn/Cu solder joint
Abstract The effects of 0.05 wt% Ni additions on In-35 wt% Sn (In–35Sn) alloy on the ex-situ
interfacial reactions, in-situ microstructures formation during solidification, and mechanical …
interfacial reactions, in-situ microstructures formation during solidification, and mechanical …
Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7 Cu solder: Experiments and first-principles calculations
A Yang, K Xiao, Y Duan, C Li, J Yi, M Peng… - Materials Science and …, 2022 - Elsevier
Abstract Sn-0.7 Cu–In ternary alloy solders have received much attention because of their
excellent weld stability and wettability. However, how to inhibit or slow down the formation of …
excellent weld stability and wettability. However, how to inhibit or slow down the formation of …
Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy
Abstract The In–48Sn eutectic alloy has emerged as a favorable solder for flexible electronic
devices, owing to its low operating temperature. However, the low strength of In–48Sn …
devices, owing to its low operating temperature. However, the low strength of In–48Sn …
Humidity-driven switch in the transparency of a nanofiber film for a smart window
C Xiang, W Wang, S Wang, S Liu, M Li… - The Journal of Physical …, 2021 - ACS Publications
Traditional smart windows use electrical signals to transform transparency. However, this
electric transmission mode greatly limits their uses. Here, we have prepared a transparent …
electric transmission mode greatly limits their uses. Here, we have prepared a transparent …
[HTML][HTML] Microstructure evolution and shear strength of tin-indium-xCu/Cu joints
The low melting temperature In-48Sn alloy is a promising candidate for flexible devices.
However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid …
However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid …
Switchable adhesion with a high tuning ratio achieved on polymer surfaces with embedded low-melting-point alloy
The ability to control adhesion with a high tuning ratio and robust performance in a
reversible manner is highly desirable for many engineering applications. Here, by …
reversible manner is highly desirable for many engineering applications. Here, by …