[HTML][HTML] Selective compositional range exclusion via directed energy deposition to produce a defect-free Inconel 718/SS 316L functionally graded material

SH Kim, H Lee, SM Yeon, C Aranas Jr, K Choi… - Additive …, 2021 - Elsevier
In this research, additively manufacturing a functionally graded material (FGM) with a
compositional range of Ni-based Inconel superalloy (Inconel 718) and Fe-based stainless …

Topography‐supported nanoarchitectonics of hybrid scaffold for systematically modulated bone regeneration and remodeling

TS Jang, SJ Park, JE Lee, J Yang… - Advanced Functional …, 2022 - Wiley Online Library
Orthopedic implants should have sufficient strength and promote bone tissue regeneration.
However, most conventional implants are optimized for use either under high mechanical …

Additive manufacturing of a shift block via laser powder bed fusion: The simultaneous utilisation of optimised topology and a lattice structure

SH Kim, SM Yeon, JH Lee, YW Kim, H Lee… - Virtual and physical …, 2020 - Taylor & Francis
The precise shape of a shift block support for the turbine blade of a hovercraft was additively
manufactured using 17–4 precipitation-hardened stainless steel (STS 630) powder through …

CALPHAD-guided alloy design of Sn–In based solder joints with multiphase structure and their mechanical properties

X Luo, J Peng, W Zhang, S Wang, S Cai… - Materials Science and …, 2022 - Elsevier
A CALPHAD-guided alloy design and the corresponding key experiments method were
performed to study the microstructure-mechanical properties relationships for Sn–In based …

The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt% Sn/Cu solder joint

MS Chang, MAAM Salleh, F Somidin, DSC Halin… - Materials Science and …, 2023 - Elsevier
Abstract The effects of 0.05 wt% Ni additions on In-35 wt% Sn (In–35Sn) alloy on the ex-situ
interfacial reactions, in-situ microstructures formation during solidification, and mechanical …

Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7 Cu solder: Experiments and first-principles calculations

A Yang, K Xiao, Y Duan, C Li, J Yi, M Peng… - Materials Science and …, 2022 - Elsevier
Abstract Sn-0.7 Cu–In ternary alloy solders have received much attention because of their
excellent weld stability and wettability. However, how to inhibit or slow down the formation of …

Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy

D Le Han, YA Shen, S He, H Nishikawa - Materials Science and …, 2021 - Elsevier
Abstract The In–48Sn eutectic alloy has emerged as a favorable solder for flexible electronic
devices, owing to its low operating temperature. However, the low strength of In–48Sn …

Humidity-driven switch in the transparency of a nanofiber film for a smart window

C Xiang, W Wang, S Wang, S Liu, M Li… - The Journal of Physical …, 2021 - ACS Publications
Traditional smart windows use electrical signals to transform transparency. However, this
electric transmission mode greatly limits their uses. Here, we have prepared a transparent …

[HTML][HTML] Microstructure evolution and shear strength of tin-indium-xCu/Cu joints

DL Han, YA Shen, F Huo, H Nishikawa - Metals, 2021 - mdpi.com
The low melting temperature In-48Sn alloy is a promising candidate for flexible devices.
However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid …

Switchable adhesion with a high tuning ratio achieved on polymer surfaces with embedded low-melting-point alloy

B Peng, QA Wang, XQ Feng, Q Li - Extreme Mechanics Letters, 2021 - Elsevier
The ability to control adhesion with a high tuning ratio and robust performance in a
reversible manner is highly desirable for many engineering applications. Here, by …