Next‐generation machine vision systems incorporating two‐dimensional materials: progress and perspectives
Abstract Machine vision systems (MVSs) are an important component of intelligent systems,
such as autonomous vehicles and robots. However, with the continuous increase in data …
such as autonomous vehicles and robots. However, with the continuous increase in data …
A Review of Digital Pixel Sensors
Digital pixel sensor (DPS) has evolved as a pivotal component in modern imaging systems
and has the potential to revolutionize various fields such as medical imaging, astronomy …
and has the potential to revolutionize various fields such as medical imaging, astronomy …
[图书][B] Smart CMOS image sensors and applications
J Ohta - 2020 - taylorfrancis.com
Revised and expanded for this new edition, Smart CMOS Image Sensors and Applications,
Second Edition is the only book available devoted to smart CMOS image sensors and …
Second Edition is the only book available devoted to smart CMOS image sensors and …
Real-time gaze tracking with event-driven eye segmentation
Y Feng, N Goulding-Hotta, A Khan… - … IEEE Conference on …, 2022 - ieeexplore.ieee.org
Gaze tracking is increasingly becoming an essential component in Augmented and Virtual
Reality. Modern gaze tracking algorithms are heavyweight; they operate at most 5 Hz on …
Reality. Modern gaze tracking algorithms are heavyweight; they operate at most 5 Hz on …
Camj: Enabling system-level energy modeling and architectural exploration for in-sensor visual computing
CMOS Image Sensors (CIS) are fundamental to emerging visual computing applications.
While conventional CIS are purely imaging devices for capturing images, increasingly CIS …
While conventional CIS are purely imaging devices for capturing images, increasingly CIS …
Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications
Z Wang - Microelectronic Engineering, 2019 - Elsevier
As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …
[HTML][HTML] From near-sensor to in-sensor: a state-of-the-art review of embedded AI vision systems
In modern cyber-physical systems, the integration of AI into vision pipelines is now a
standard practice for applications ranging from autonomous vehicles to mobile devices …
standard practice for applications ranging from autonomous vehicles to mobile devices …
The influence of Cu microstructure on thermal budget in hybrid bonding
L Mirkarimi, C Uzoh, D Suwito, B Lee… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
Advanced package modules built with a hybrid bonding technology offer enhanced thermal
performance, reliability, and scalability with the Cu-Cu interconnect. Direct Bond …
performance, reliability, and scalability with the Cu-Cu interconnect. Direct Bond …
A stacked embedded DRAM array for LPDDR4/4X using hybrid bonding 3D integration with 34GB/s/1Gb 0.88 pJ/b logic-to-memory interface
B Fujun, J Xiping, W Song, Y Bing, T Jie… - 2020 IEEE …, 2020 - ieeexplore.ieee.org
Increasing demand for DRAM scaling and high-bandwidth has driven DRAM technology to
3D/2.5 D integration. With the innovative Hybrid Bonding technology, a new Stacked …
3D/2.5 D integration. With the innovative Hybrid Bonding technology, a new Stacked …
Copper bonding technology in heterogeneous integration
As semiconductor device scaling faces a severe technical bottleneck, vertical die stacking
technologies have been developed to obtain high performance, high density, low latency …
technologies have been developed to obtain high performance, high density, low latency …