The combination of aluminum (Al) and silver (Ag) for wire bonding is long established:
aluminum (Al) heavy wire bonding on silver (Ag) metallization, such as pastes consisting of …

With all the advances in 2.5 D and 3D packaging, wire bonding is still the most popular
interconnect technology and the workhorse of the industry. Wire bonding technology has …

Copper (Cu) wire bonding is new alternative to traditional Gold (Au) wirebonds. Since Cu is
not as inert as Au, material selection in the package plays key role in reliability of packages …

In this study the mechanical properties and fatigue behavior of ultra-fine gold wires are
investigated by experimental tension fatigue tests and finite element (FE) simulation …

Migration to Cu wirebond from traditional gold wirebond is recent trend in packaging
industry. Selection of different materials, such as EMC used in the molding process plays …

Abstract System-in-Package (SiP) have seen a lot of growth in recent years especially in
mobile devices due to its higher level of system integration, more design flexibility and …

Wire bond evaluation is crucial in determining its quality. With the increase in use of copper
wire bonds, this becomes even more important due to its nature to induce defects such as …

Quad Flat No-Lead (QFN) is one of the fastest growing semiconductor packages. It offers a
variety of advantages including near-chip scale footprint, reduced lead inductance, thin …

当前集成电路设计和制造方面的发展速度很快, 集成电路规模和水平不断提高,
也促进了相应的测试技术的发展. 集成电路交流参数的准确性已经成为影响集成电路性能的重要 …

当今便携式设备的速率可达数吉比特每秒, 但是其通道的频宽限制其性能. 在所有芯片与基板的
传输结构中键合线是最常用的, 但却渐渐成为了带宽主要的限制. 基于一款高密度布线系统级 …