[HTML][HTML] Impact of Nitridation on Bias Temperature Instability and Hard Breakdown Characteristics of SiON MOSFETs

S Tyaginov, B O'Sullivan, A Chasin, Y Rawal… - Micromachines, 2023 - mdpi.com
We study how nitridation, applied to SiON gate layers, impacts the reliability of planar metal-
oxide-semiconductor field effect transistors (MOSFETs) subjected to negative and positive …

Simulation comparison of hot-carrier degradation in nanowire, nanosheet and forksheet FETs

M Vandemaele, B Kaczer, S Tyaginov… - 2022 IEEE …, 2022 - ieeexplore.ieee.org
Forksheet (FS) FETs are a novel transistor architecture consisting of vertically stacked nFET
and pFET sheets at opposite sides of a dielectric wall. The wall allows reducing the p-to …

Towards complete recovery of circuit degradation by annealing with on-chip heaters

J Diaz-Fortuny, P Saraza-Canflanca… - IEEE Electron …, 2022 - ieeexplore.ieee.org
This work reports an on-chip heater structure fabricated in the Front End of Line (FEOL) on a
versatile ring-oscillator (RO) array utilized to conduct statistical characterization of on-chip …

Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations

M Vandemaele, B Kaczer, E Bury… - 2023 IEEE …, 2023 - ieeexplore.ieee.org
We report TCAD simulation studies on nanowire (NW), nanosheet (NS) and forksheet (FS)
FET hot-carrier relia-bility. The simulations entail i) solving the Boltzmann transport equation …

Trapping of hot carriers in the forksheet FET wall: a TCAD study

M Vandemaele, B Kaczer, S Tyaginov… - IEEE Electron …, 2022 - ieeexplore.ieee.org
We simulate the spatial profile of trapped charge in the forksheet FET wall under hot-carrier
stress by calculating carrier distribution functions and using a non-radiative multiphonon …

Extraction of Charge Trapping Kinetics of Defects from Single-Defect Measurements

M Waltl, B Stampfer, T Grasser - IEEE Transactions on Device …, 2024 - ieeexplore.ieee.org
Charge trapping at oxide defects poses a serious reliability concern in MOS transistors. For
scaled technology nodes, the impact of charge-trapping events on device behavior becomes …

Advanced Extraction of Trap Parameters from Single-Defect Measurements

M Waltl, B Stampfer, T Grasser - 2023 IEEE International …, 2023 - ieeexplore.ieee.org
Charge trapping at oxide defects is a serious reliability concern in MOS transistors. For
scaled technology nodes, the impact of charge-trapping events on the device behavior …

Productivity enhancement study: yield, cost, and turn-around-time modeling for EUV and high NA EUV

YP Tsai, YH Chang, J Wang, D Trivkovic… - DTCO and …, 2023 - spiedigitallibrary.org
A yield prediction model with a corresponding cost of the ownership (CoO) and turn-around-
time (TAT) analysis is studied on imec's advanced technology nodes that include EUV and …

A Simulation Study of Junctionless Forksheet on Sub-2 nm Node Logic Applications

X Shi, T Liu, Y Wang, R Chen, N Zhang… - … on Electron Devices, 2023 - ieeexplore.ieee.org
This article presents an evaluation of the CMOS logic performance of a junctionless (JL)
forksheet based on 3-D numerical simulation. The study investigates the transfer …

Reliability challenges in Forksheet Devices

E Bury, M Vandemaele, J Franco… - 2023 IEEE …, 2023 - ieeexplore.ieee.org
The forksheet (FSH) device architecture is a possible candidate towards continued logic cell
downscaling. It consists of vertically stacked n-and p-type sheets at opposing sides of a …