The past two decades have witnessed the rapid development of nanocalorimetry, a novel
materials characterization technique that employs micromachined calorimetric sensors. The …

Quasi-in-situ method was carried out to observe the growth behavior of intermetallic
compounds (IMCs) in Cu/Sn-3.0 Ag-0.5 Cu/Cu micro solder joints with single β-Sn grain …

The phenomenon of tin pest has been known for hundreds of years. Tin is one of the most
common materials used in electronic products and systems. It is found in solders, as a …

Due to the advantages of high thermal conductivity, high heat storage density per unit
volume and large specific surface area, metal-based microencapsulated phase change …

We show that cobalt-microalloying causes significant grain refinement in large samples (60
g) of Sn-3Ag-0.5 Cu solder. Nucleation occurs on the (100) facet of αCoSn 3 crystals with a …

A Cu 6 Sn 5 layer is an integral part of many electronic interconnections. Here we show that,
although primary Cu 6 Sn 5 is not a potent nucleant for Sn, the Cu 6 Sn 5 layer plays a key …

An ideal microencapsulated phase change material (MEPCM) should have the
characteristics of high thermal reliability, low supercooling degree and high thermal …

Abstract Eutectic Ag3Sn can grow with a variety of morphologies depending on the
solidification conditions and plays an important role in the performance of Pb-free solders …

The microstructure control and refinement in length scale are pursued in the development of
next generations of Pb-free solder alloys with high reliability in harsh environments. In the …

Abstract βSn nucleation is a key step in the formation of microstructure in electronic solder
joints. Here, the heterogeneous nucleation of βSn is studied in undercooled tin droplets …