In this study, advanced packaging is defined. The kinds of advanced packaging are ranked
based on their interconnect density and electrical performance, and are grouped into 2-D …

With the continuous reduction of chip feature size, the continuation of Moore's Law becomes
increasingly difficult and heterogeneous integration has become one of the important …

In this study, the recent advances and trends in multiple system and heterogeneous
integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC …

The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are
presented in this study. Emphasis is placed on:(A) the package formations such as (a) chip …

Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-
effective approach to in-package high density interconnects of heterogeneous chips …

The design, materials, process, fabrication, and reliability of a heterogeneous integration of
four chips and four capacitors by a fan-out wafer-level packaging (FOWLP) method are …

The state of the art of lead-free solder joint reliability is investigated in this study. Emphasis is
placed on the design for reliability (DFR) and reliability testing and data analysis. For …

The design, materials, process, fabrication, and reliability of a heterogeneous integration of
four chips by a fan-out panel-level packaging (FOPLP) method are investigated in this …

In this paper, the warpages of a chip-first and die face-up fan-out wafer-level packaging
(FOWLP) with a very large silicon chip (10 mm× 10 mm× 0.15 mm) and three redistributed …

To meet the requirements of low cost, thin vehicles, and multiple functions, the fan-out panel-
level packaging (FO-PLP) is introduced to be one of the next-generation packaging …