Wire bonding is still the most popular chip interconnect technology in microelectronic
packaging and will not be replaced by other interconnect methods for a long time in the …

Purpose–The purpose of this paper is to provide a systematic review on technical findings
and discuss the feasibility and future of gold (Au) wirebonding in microelectronics …

Large scale conversion of gold to copper wiring in microelectronics can only become
successful when all the failure mechanisms that can be encountered during reliability …

This study investigated the electrochemical characterizations in the field of wire metallurgy
(Pd concentration) and molding compound chemistry (chloride concentration) to find ways to …

The entropy evaluation method of assembly stress has become a hot topic in recent years.
However, the current research can only evaluate the maximum stress magnitude and stress …

Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its
significant cost savings over gold wire. However, concerns on corrosion susceptibility and …

Semiconductor chips are packaged in a process that involves creating a path to allow for
signals to be exchanged with the outside world and ultimately achieving a form to protect …

热超声键合是目前最重要的引线键合技术, 在电子封装领域中有着广泛的应用.
面对封装密度不断提高, 焊点节距不断下降和成本持续降低等挑战, 工程技术人员需要全面了解 …

This paper presents a tripartite version of particle swarm optimisation, genetic algorithm, and
simulated annealing (PSO-GA-SA) optimisation strategy addressing some predominant …

Quad Flat No-Lead (QFN) is one of the fastest growing semiconductor packages. It offers a
variety of advantages including near-chip scale footprint, reduced lead inductance, thin …