The present disclosure is directed to a method of determining at least one correctable for a
process tool. In an embodiment, the method includes the steps of: measuring one or more …

With the continuous shrink in pattern size and increased density, overlay control has
become one of the most critical issues in semiconductor manufacturing. Recently, SEM …

In recent years overlay (OVL) control schemes have become more complicated in order to
meet the ever shrinking margins of advanced technology nodes. As a result, this brings up …

In order to meet the industry's increasingly demanding requirements, especially in the area
of improving pattern edge placement error for multiple patterning processes, we have …

With the introduction of Nix process nodes, leading-edge factories are facing challenging
demands in shrinking design margins. Previously uncorrected high-order signatures, and …

With the introduction of N2x and N1x process nodes, leading-edge factories are facing
challenging demands of shrinking design margins. Previously un-corrected high-order …

We analyze performance of different customized models on baseliner overlay data and
demonstrate the reduction in overlay residuals by~ 10%. Smart Sampling sets were …