Exotic three-phase microstructures in the ternary Ag-Cu-Sb eutectic system
Eutectic solidification in ternary systems is a complex process involving the interaction of
several material and process parameters resulting in the formation of intriguing patterns …
several material and process parameters resulting in the formation of intriguing patterns …
Physical and mechanical properties of Al-Si-Ni eutectic alloy
U Böyük - Metals and Materials International, 2012 - Springer
Abstract Al-11.1 wt% Si-4.2 wt% Ni alloy was directionally solidified upward under different
conditions, with different growth rates (V= 4.60–243.33 μm/s) at a constant temperature …
conditions, with different growth rates (V= 4.60–243.33 μm/s) at a constant temperature …
Hardness variation in cast-forging process of AZ80 magnesium alloys and its data-driven prediction
This paper investigates the effects of the cast-forged process on the hardness distribution of
the AZ80 magnesium alloy. AZ80 material is cast at four different cooling rates and die …
the AZ80 magnesium alloy. AZ80 material is cast at four different cooling rates and die …
Microstructural characterization of unidirectional solidified eutectic Al–Si–Ni alloy
Al–11.1 wt.% Si–4.2 wt.% Ni eutectic alloy was directionally solidified upward at a constant
temperature gradient (G= 5.82 K/mm) in a wide range of growth rates (V= 4.60–243.33 μm/s) …
temperature gradient (G= 5.82 K/mm) in a wide range of growth rates (V= 4.60–243.33 μm/s) …
Determination of mechanical, electrical and thermal properties of the Sn―Bi―Zn ternary alloy
The development of lead-free solders has emerged as one of the key issues in the
electronics packaging industries. Sn―Zn―Bi eutectic alloy has been considered as one of …
electronics packaging industries. Sn―Zn―Bi eutectic alloy has been considered as one of …
Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn–Ag–Cu lead-free solder
Sn–3.5 wt.% Ag–0.9 wt.% Cu alloy was directionally solidified upward at a constant growth
rate (V= 7.20 μms− 1) with different temperature gradients (G= 2.48–6.34 Kmm− 1) by using …
rate (V= 7.20 μms− 1) with different temperature gradients (G= 2.48–6.34 Kmm− 1) by using …
Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al–Cu–Ag eutectic alloy
Al–Cu–Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83–
498.25 μm/s) at a constant temperature gradient (8.79 K/mm) and with different temperature …
498.25 μm/s) at a constant temperature gradient (8.79 K/mm) and with different temperature …
Effect of solidification parameters on the microstructure of Sn-3.7 Ag-0.9 Zn solder
In this work, Sn–Ag–Zn alloy of eutectic composition (Sn-3.7 wt.% Ag-0.9 wt.% Zn) was
directionally solidified upward at a constant temperature gradient (G= 4.33 K/mm) in a wide …
directionally solidified upward at a constant temperature gradient (G= 4.33 K/mm) in a wide …
Effects of external static electrical field on thermal and electrical conductivity in the Al-Cu, Al-Ni, and Al-Si eutectic alloys
This study aims to investigate the effects of external positive and negative static electric
fields (E+ and E-respectively) on thermal conductivity (K) and electrical conductivity (σ) in Al …
fields (E+ and E-respectively) on thermal conductivity (K) and electrical conductivity (σ) in Al …
Investigation of microhardness and thermo-electrical properties in the Sn–Cu hypereutectic alloy
Sn–3 wt% Cu hypereutectic alloy was directionally solidified upward with different growth
rates (2.24–133.33 μm/s) at a constant temperature gradient (4.24 K/mm) and with different …
rates (2.24–133.33 μm/s) at a constant temperature gradient (4.24 K/mm) and with different …