With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder
has attracted wide attention due to its excellent comprehensive performance and low cost. In …

As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …

Abstract Large Ag 3 Sn plates in solder joints can affect the reliability of electronics,
however, the factors affecting their nucleation and morphology are not well understood …

The growth mechanisms of primary Cu 6 Sn 5 are studied in Sn-Cu alloys and solder joints
by combining EBSD, FIB-tomography and synchrotron radiography. With increasing cooling …

The phase stability, elastic properties, fracture toughness, electronic structure and thermal
conductivity of Ni-doped η'-Cu 6 Sn 5 have been obtained using first-principles calculations …

A Cu 6 Sn 5 layer is an integral part of many electronic interconnections. Here we show that,
although primary Cu 6 Sn 5 is not a potent nucleant for Sn, the Cu 6 Sn 5 layer plays a key …

Abstract βSn nucleation is a key step in the formation of microstructure in electronic solder
joints. Here, the heterogeneous nucleation of βSn is studied in undercooled tin droplets …

High-temperature-stable circuit interconnects are highly desirable for the wide band-gap
semiconductor devices to operate in harsh environment (> 200° C). In this study, a full Cu 3 …

This paper aims to investigate the influence of composite flux on the interfacial reaction,
wettability, and shear strength evolution of Sn-3.0 Ag-0.5 Cu (SAC305) solder joint; the …

This paper investigates the effect of 0.05 wt.% Ni on the formation and growth of primary Cu
6 Sn 5 in Sn-0.7 wt.% Cu solder paste soldered on a Cu substrate, using a real-time …